Dr. Philippe Leray
Group leader of Advanced Metrology at imec
SPIE Involvement:
Conference Program Committee | Author
Publications (90)

Proceedings Article | 8 October 2020 Presentation + Paper
Proc. SPIE. 11517, Extreme Ultraviolet Lithography 2020
KEYWORDS: Wafer-level optics, Signal to noise ratio, Reticles, Inspection, Wafer inspection, Photomasks, Algorithm development, Semiconducting wafers, Optics manufacturing, Plasma

Proceedings Article | 20 September 2020 Presentation
Proc. SPIE. 11517, Extreme Ultraviolet Lithography 2020
KEYWORDS: Reticles, Etching, Scanners, Extreme ultraviolet, Extreme ultraviolet lithography, Critical dimension metrology

Proceedings Article | 25 June 2020 Presentation + Paper
Proc. SPIE. 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV
KEYWORDS: Wafer-level optics, Metrology, Scanning electron microscopy, Transmission electron microscopy, Photomasks, Dysprosium, Line edge roughness, Semiconducting wafers, Overlay metrology, Scanning transmission electron microscopy

Proceedings Article | 12 May 2020 Paper
Proc. SPIE. 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV
KEYWORDS: Etching, Metals, Resistance, Transmission electron microscopy, Scatterometry, Photomasks, Machine learning, Line edge roughness, Semiconducting wafers, Ruthenium

Proceedings Article | 2 April 2020 Paper
Proc. SPIE. 11325, Metrology, Inspection, and Process Control for Microlithography XXXIV
KEYWORDS: Electron beam lithography, Metrology, Logic, Metals, Scanning electron microscopy, Extreme ultraviolet lithography, Optical proximity correction, Semiconducting wafers, OLE for process control, Back end of line

Showing 5 of 90 publications
Conference Committee Involvement (3)
Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV
22 February 2021 | Online Only, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXIV
24 February 2020 | San Jose, California, United States
Metrology, Inspection, and Process Control for Microlithography XXXIII
25 February 2019 | San Jose, California, United States
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