Mr. Richard Collett Profile

Richard Collett

VP, Technology Development

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Author

Publications (4)

Proceedings Article | 31 March 2010 Paper

Process optimization consideration for 193nm developable bottom anti-reflective coatings (DBARCs)

Takanori Kudo, Srinivasan Chakrapani, Alberto Dioses, Edward Ng, Charito Antonio, Deepa Parthasarathy, Richard Collett, Mark Neisser, Munirathna Padmanaban

Proc. SPIE. 7639, Advances in Resist Materials and Processing Technology XXVII

KEYWORDS: Lithography, Etching, Polymers, Silicon, Coating, Fourier transforms, Plasma etching, 193nm lithography, Plasma, Bottom antireflective coatings

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Proceedings Article | 11 December 2009 Paper

Latest developments in photosensitive developable bottom anti-reflective coating (DBARC)

Takanori Kudo, Srinivasan Chakrapani, Alberto Dioses, Edward Ng, Charito Antonio, Deepa Parthasarathy, Shinji Miyazaki, Yuki Ubayashi, Kazuma Yamamoto, Yasushi Akiyama, Richard Collett, Mark Neisser, Munirathna Padmanaban

Proc. SPIE. 7520, Lithography Asia 2009

KEYWORDS: Lithography, Etching, Polymers, Silicon, Fourier transforms, Scanning electron microscopy, Plasma etching, Semiconducting wafers, Plasma, Bottom antireflective coatings

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Proceedings Article | 1 April 2009 Paper

Double imaging with resist freezing in a vapor reaction chamber

Ralph Dammel, Yusuke Takano, Richard Collett, David Abdallah

Proc. SPIE. 7273, Advances in Resist Materials and Processing Technology XXVI

KEYWORDS: FT-IR spectroscopy, Image processing, Nitrogen, Fourier transforms, Photoresist materials, Double patterning technology, Head-mounted displays, Photoresist processing, Semiconducting wafers, Electronic design automation

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Proceedings Article | 4 December 2008 Paper

Spin-on trilayer scheme: enabling materials for extension of ArF immersion lithography to 32nm node and beyond

Ruzhi Zhang, Allen Timko, Lyudmila Pylneva, Jennifer Loch, Hengpeng Wu, David Abdallah, Richard Collett, Yayi Wei, Dalil Rahman, Douglas McKenzie, Ping-Hung Lu, Mark Neisser

Proc. SPIE. 7140, Lithography Asia 2008

KEYWORDS: Lithography, Etching, Polymers, Silicon, Coating, Reflectivity, Fourier transforms, Photoresist materials, Immersion lithography, Semiconducting wafers

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