Proceedings Article | 1 August 2002
Se-Jong Choi, Han-Sun Cha, Si-Yeul Yoon, Yong-Dae Kim, Dong-Hyuk Lee, Jin-Min Kim, Jin-Su Kim, Dong-Soo Min, Pil-Jin Jang, Byung-Soo Chang, Hyuk-Joo Kwon, Boo-Yeon Choi, Sang-Soo Choi, Soo Hong Jeong
Proc. SPIE. 4754, Photomask and Next-Generation Lithography Mask Technology IX
KEYWORDS: Etching, Gases, Surface roughness, Scanning electron microscopy, Photomasks, Plasma etching, Chlorine, Anisotropic etching, Plasma, Phase shifts
There is considerable interest in phase shift masks as a route to extending the resolution, contrast, and depth of focus of lithographic tools beyond what is achievable with the normal chrome mask technology. A problem that has so far hindered the introduction of phase shift masks has been the difficulty of phase and transmittance control when a phase shift mask is applied to practical use. Also, to apply phase shift layer (MoSiON), it remains that effects several critical mask parameters including sidewall slope, surface roughness, and critical dimension. For these reasons, this process requires a high degree of control of the etch process of shift layer. So in this paper, we described a technique for the fabrication of phase shift masks by etch rate of a MoSiON layer. Etching experiments of MoSiON were performed using different fluorinated gas mixtures. Four of them, CF4/O2/He, SF6/O2/He, CHF3/O2/He and Cl2/CF4/O2/He were chosen for high etch rate, sidewall slope, and surface morphology. Each added gases had a unique property on the etch rate, anisotropy, surface roughness and sidewall morphology. Result indicates that vertical slope and smooth surface are obtained using the Cl2/ CF4/O2/He and SF6/O2/He mixture. With increasing O2 flow rate to the SF6/O2/He Plasma and added Cl2 gas to the CF4/O2/He Plasma, the MoSiON etching profile becomes anisotropic without undercutting and trench profile. It is probably due to both increasing etch rate and sidewall passivation of Cl2 ion flux. When Cl2 gas was added to the CF4/O2/He Plasma, the small addition of chlorine was enough to protect the exposed sidewall of the undercutting, therefore, higher flow rate of chlorine had to be added to protect the sidewall of the undercutting by forming a sidewall passivation layer. These results show that both increasing O2 flow rate to the SF6/O2/He Plasma and the addition of Cl2 to the CF4/O2/He plasma are necessary in order to achieve a vertical profile and a smooth surface morphology.
