Mr. Stefan Weichselbaum Profile

Stefan Weichselbaum

at ASML Netherlands BV

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Publications (7)

Proceedings Article | 24 March 2017 Paper

Reticle heating feed-forward control (RHC2) on NXT:1980Di immersion scanner for enhanced on-product overlay

Richard Droste, Bart Paarhuis, Roelof de Graaf, Jeroen van der Wielen, Barry Moest, Niek Verbeek, Marco Stavenga, Stefan Weichselbaum, Young Ha Kim, Jonghoon Jang, Byeong Soo Lee, Hyunwoo Hwang, Youngsun Nam, Jeong-Heung Kong, Young Seog Kang, Se-Yeon Jang, Joris Jongen

Proceedings Volume 10147, 1014717 (2017) https://doi.org/10.1117/12.2259792

KEYWORDS: Reticles, Scanners, Distortion, HVAC controls, Optical alignment, Control systems, Thermal effects, Temperature metrology, Semiconducting wafers, Overlay metrology, Calibration

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Scanners in High-Volume-Manufacturing conditions will experience a large range of reticles that vary in reticle transmission and reticle diffraction characteristics. Especially under full production loads reticles will heat up due to the exposure light-load and as such experience thermo-mechanical deformations. The resulting reticle pattern distortion can be partially translated in a deteriorated overall system overlay. Due to the geometry of the reticle and exposure fields, these reticle thermal effects are in general barrel-shape distortions that can be well corrected with the available set of lens manipulators. Nevertheless node-over-node the residual overlay errors associated with thermo-mechanical reticle deformation needs further reduction since it contributes to the total onproduct overlay performance. To reduce overlay caused by reticle temperature drift, NXT1980Di includes an active cooling mechanism suppressing the reticle temperature changes during exposure significantly. Even though the reticle temperature excursions are well suppressed, residual intra-wafer overlay drift effect can still be observed. Before exposure of a wafer, reticle deformation is measured during reticle align using in-line alignment / image sensors (TIS or PARIS). This is enabled by adding alignment markers around the circumference of the image field on the reticle. The measured reticle deformations are then fed to the system control network and dynamically corrected for by making use of the available manipulators in the scanner and the projection lens. Wafer-by-wafer reticle distortion measurements are performed to accurately capture the transient dynamics present in reticle heating during normal production lots. A new version of Reticle Heating Feed-forward Control (RHC2) is introduced that uses reticle-heating-induced deformation measurements over time and exposure sequence information to calibrate reticle-deformation-predictionmodels. These models are based on thermo-mechanical models that simulate reticle deformation under various exposure conditions and are applied in-line to the exposures to reduce intra-wafer overlay drift effects.

Proceedings Article | 24 March 2017 Presentation + Paper

Layout independent leveling (LIL) on NXT:1980Di immersion scanners for enhanced productivity

Roelof de Graaf, Arjan Holscher, Elliot Oti, Stefan Weichselbaum, ByeongSoo Lee, Young Seog Kang, Young Ha Kim, Jeong-Heung Kong, Jong Hoon Jang, YoungSun Nam, Hyunwoo Hwang, Ralf Gommers, Chansam Chang, Bram van Hoof, Jeroen Cottaar, Marcel Raas, Samah Khalek, Jan van Kemenade, Maarten Voncken, Richard Droste

Proceedings Volume 10147, 101471A (2017) https://doi.org/10.1117/12.2259794

KEYWORDS: Semiconducting wafers, Sensors, Time metrology, Scanners, Optical alignment, Calibration, Wafer testing, Overlay metrology, Metrology, Computer programming

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Proceedings Article | 15 March 2016 Paper

NXT:1980Di immersion scanner for 7nm and 5nm production nodes

Wim de Boeij, Roelof de Graaf, Stefan Weichselbaum, Richard Droste, Matthew McLaren, Bert Koek

Proceedings Volume 9780, 978011 (2016) https://doi.org/10.1117/12.2220589

KEYWORDS: Reticles, Scanners, Semiconducting wafers, Optical alignment, Overlay metrology, Calibration, Sensors, Control systems, Imaging systems, Semiconductor manufacturing

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Proceedings Article | 15 March 2016 Paper

Improvement of unbalanced illumination induced telecentricity within the exposure slit

Wim de Boeij, Jonghoon Jang, ByeongSoo Lee, Young Seog Kang, Chansam Chang, Wim Bouman, Roelof de Graaf, Stefan Weichselbaum, Richard Droste, Bart van Bussel, Patrick Neefs, Arij Rijke, Jeong-Heung Kong, Young Ha Kim

Proceedings Volume 9780, 97800X (2016) https://doi.org/10.1117/12.2220588

KEYWORDS: Lithography, Lithographic illumination, Optical alignment, Scanners, Optical lithography, Image enhancement, Reticles, Electronics

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Proceedings Article | 15 March 2016 Paper

Overcoming low-alignment signal contrast induced alignment failure by alignment signal enhancement

Byeong Soo Lee, Young Ha Kim, Young Seog Kang, Jeongjin Lee, Bart Paarhuis, Haico Kok, Roelof de Graaf, Stefan Weichselbaum, Richard Droste, Christopher Mason, Jeong Heung Kong, Igor Aarts, Hyunwoo Hwang, Wim de Boeij

Proceedings Volume 9780, 97800B (2016) https://doi.org/10.1117/12.2220587

KEYWORDS: Optical alignment, Signal processing, Overlay metrology, Optical lithography, Optics manufacturing, Opacity, Materials processing, Sensors, Wafer testing, Near infrared, Image processing

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Proceedings Article | 18 March 2015 Paper

Immersion and dry scanner extensions for sub-10nm production nodes

Stefan Weichselbaum, Wim de Boeij, Richard Droste, Frank Bornebroek, Toine de Kort, Roelof de Graaf, Rob van Ballegoij, Herman Botter, Matthew McLaren

Proceedings Volume 9426, 942616 (2015) https://doi.org/10.1117/12.2087112

KEYWORDS: Semiconducting wafers, Scanners, Reticles, Imaging systems, Neodymium, Calibration, Metrology, Lithography, Optical lithography, Overlay metrology

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Proceedings Article | 13 March 2012 Paper

Extending 1.35 NA immersion lithography down to 1x nm production nodes

Bart Paarhuis, Roelof de Graaf, Rob van Ballegoij, Marcel Beems, Martin Verhoeven, Robert Kazinczi, Jan Jaap Kuit, Pieter Gunter, Igor Bouchoms, Stefan Weichselbaum, Martijn Leenders

Proceedings Volume 8326, 83260L (2012) https://doi.org/10.1117/12.915807

KEYWORDS: Semiconducting wafers, Reticles, Sensors, Scanners, Control systems, Optical alignment, HVAC controls, Wavefronts, Process control, Lithography

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Showing 5 of 7 publications

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