For applications such as computers, cellular telephones and Microsystems, it is essential to reduce the size and the
weight of DC-DC converters. To miniaturize passive components, micromachining techniques provide solutions based
on low-temperature process compatible with active part of the converter. This paper deals with the integration on silicon
of "spiral-type" inductor topology. Electroplating techniques are used to achieve the copper conductor and the CoNiFe
laminated magnetic core and several investigations on the electroplating bath's parameters have been realized in order to
obtain the adequate magnetic properties. Finally, a 1μH micro-inductor prototype has been characterized.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.