Mr. Tatsuya Hinago Profile

Tatsuya Hinago

at Takaoka Toko Co Ltd

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 18 August 2018 Presentation + Paper

The dimensional measurement of micro objects using the linear scanning confocal surface shape measurement system

Tatsuya Hinago, Mitsuhiro Ishihara, Yukihiro Otani

Proceedings Volume 10749, 1074905 (2018) https://doi.org/10.1117/12.2319812

KEYWORDS: Confocal microscopy, Image acquisition, Semiconductors, Integrated circuits, Image processing, Edge detection, Image analysis, Reliability, Optical components, Photomasks

Read Abstract +

There are a lot of surface shape measurement methods. Appropriate method is selected from them in consideration of measurement accuracy, range, speed, etc. We have recently developed a system using a method among them called “linear scanning confocal surface shape measurement system” [1] for measuring micro objects. In this paper, we describe the method to measure the horizontal dimensions of micro objects concurrently with the measurement of the vertical dimension using this system. Generally, it is difficult to get the focused image for the horizontal dimensional measurement of micro objects because of insufficient depth of field of the optics. However, as the system has plural images at multiple Z positions for vertical dimension measurement, we thought that the focus problem could be solved by calculating the focused image from these images. As a concrete example of micro objects, microelectrodes of semiconductor products [2] are realistic. Microelectrodes are called bumps and electrically connects the integrated circuit chip and the package substrate. For guaranteeing the reliability of electrical connection, dimensional measurements of the bumps are required. Currently, as the density of integrated circuits increases, the arrangement density of bumps also increases. Therefore precise dimensional measurement of bumps is becoming important more and more. By using the bumps as the object under test and measuring its diameter, position and height, we confirmed the performance of developed dimensional measurement method on the system. The results showed that the system could measure a lot of bumps within a second with an accuracy of 1μm or less.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years