Dr. Tetsuya Shinjo Profile

Dr. Tetsuya Shinjo

at Nissan Chemical Corp

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Author

Publications (9)

Proceedings Article | 19 March 2012 Paper

Spin-on-carbon-hardmask with high wiggling resistance

Yasunobu Someya, Tetsuya Shinjo, Keisuke Hashimoto, Hirokazu Nishimaki, Ryo Karasawa, Rikimaru Sakamoto, Takashi Matsumoto

Proc. SPIE. 8325, Advances in Resist Materials and Processing Technology XXIX

KEYWORDS: Carbon, Lithography, Etching, Polymers, Hydrogen, Resistance, Inspection, Photomasks, Semiconducting wafers, System on a chip

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Proceedings Article | 4 December 2008 Paper

Development of multi-layer process materials for hyper-NA lithography process

Yasushi Sakaida, Makoto Nakajima, Tetsuya Shinjo, Keisuke Hashimoto

Proc. SPIE. 7140, Lithography Asia 2008

KEYWORDS: Lithography, Multilayers, Sensors, Etching, Silicon, Materials processing, Reflectivity, Immersion lithography, Semiconducting wafers, System on a chip

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Proceedings Article | 15 April 2008 Paper

High-etch-rate bottom-antireflective coating and gap-fill materials using dextrin derivatives in via first dual-damascene lithography process

Satoshi Takei, Yasushi Sakaida, Tetsuya Shinjo, Keisuke Hashimoto, Yasuyuki Nakajima

Proc. SPIE. 6923, Advances in Resist Materials and Processing Technology XXV

KEYWORDS: Lithography, Etching, Polymers, Dielectrics, Silicon, Coating, Reflectivity, Reactive ion etching, Semiconducting wafers, Bottom antireflective coatings

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Proceedings Article | 30 March 2007 Paper

Effect of solvents and cross-link reaction group concentration on via filling performance in gap fill materials

Satoshi Takei, Yasushi Sakaida, Tetsuya Shinjo

Proc. SPIE. 6519, Advances in Resist Materials and Processing Technology XXIV

KEYWORDS: Semiconductors, Lithography, Etching, Polymers, Copper, Silicon, Coating, Photoresist processing, Semiconducting wafers, Bottom antireflective coatings

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Proceedings Article | 26 March 2007 Paper

Novel approach of UV cross- link process for advanced planarization technology in 32-45 nm lithography

Satoshi Takei, Yusuke Horiguchi, Tetsuya Shinjo, Bang-Ching Ho, Yuichi Mano, Yasuyuki Nakajima, Makoto Muramatsu, Mitsuaki Iwashita, Katsuhiro Tsuchiya

Proc. SPIE. 6519, Advances in Resist Materials and Processing Technology XXIV

KEYWORDS: Lithography, Optical lithography, Etching, Dry etching, Ultraviolet radiation, Silicon, Photoresist materials, Extreme ultraviolet, Photoresist processing, Semiconducting wafers

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Proceedings Article | 23 March 2007 Paper

Wet-recess gap-fill materials for an advanced dual damascene process

Tetsuya Shinjo, Satoshi Takei, Yusuke Horiguchi, Yasuyuki Nakajima

Proc. SPIE. 6519, Advances in Resist Materials and Processing Technology XXIV

KEYWORDS: Lithography, Antireflective coatings, Etching, Coating, Photoresist materials, Reactive ion etching, Thin film coatings, Semiconducting wafers, Photoresist developing, Standards development

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Proceedings Article | 11 April 2006 Paper

New advanced BARC and gap fill materials based on sublimate reduction for 193nm lithography

Satoshi Takei, Tetsuya Shinjo, Yasushi Sakaida, Yusuke Horiguchi, Yasuyuki Nakajima

Proc. SPIE. 6153, Advances in Resist Technology and Processing XXIII

KEYWORDS: Lithography, Etching, Polymers, Silicon, Coating, Reflectivity, Photoresist materials, Absorbance, Semiconducting wafers, 193nm lithography

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Proceedings Article | 29 March 2006 Paper

New chemical approach for resist poisoning problem in via first dual-damascene process

Hajime Nakao, Satoshi Takei, Tetsuya Shinjo, Yasuyuki Nakajima

Proc. SPIE. 6153, Advances in Resist Technology and Processing XXIII

KEYWORDS: Lithography, Contamination, Polymers, Annealing, Silicon, Diffusion, Cadmium sulfide, Chemical reactions, Photoresist processing, Semiconducting wafers

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Proceedings Article | 4 May 2005 Paper

ARC and gap fill material with high etch rate for advanced dual damascene process

Tetsuya Shinjo, Satoshi Takei, Yasushi Sakaida, Anwei Qin, Yasuyuki Nakajima

Proc. SPIE. 5753, Advances in Resist Technology and Processing XXII

KEYWORDS: Lithography, Etching, Polymers, Copper, Dielectrics, Silicon, Coating, Reflectivity, Photoresist materials, Semiconducting wafers

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Showing 5 of 9 publications

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