Dr. Thomas Westphalen Profile

Dr. Thomas Westphalen

at Fraunhofer-Institut für Lasertechnik

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Author

Publications (11)

Proceedings Article | 23 February 2018 Paper

Fiber-coupled three-micron pulsed laser source for CFRP laser treatment

Sebastian Nyga, David Blass, Veronika Katzy, Thomas Westphalen, Bernd Jungbluth, Hans-Dieter Hoffmann

Proc. SPIE. 10511, Solid State Lasers XXVII: Technology and Devices

KEYWORDS: Laser sources, Optical parametric oscillators, Beam delivery, Fiber lasers, Epoxies, Beam shaping, Frequency conversion, Adhesives, Pulsed laser operation, Absorption

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Proceedings Article | 4 March 2016 Paper

CFRP bonding pre-treatment with laser radiation of 3 µm wavelength: laser/material interaction

David Blass, Stefan Kreling, Sebastian Nyga, Thomas Westphalen, Bernd Jungbluth, Hans-Dieter Hoffman, Klaus Dilger

Proc. SPIE. 9736, Laser-based Micro- and Nanoprocessing X

KEYWORDS: Carbon, Laser sources, Optical parametric oscillators, Contamination, Structured optical fibers, Fiber lasers, Laser ablation, Epoxies, Frequency conversion, Adhesives, Absorption

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Proceedings Article | 7 March 2014 Paper

Automated alignment of fast-axis collimator lenses for high-power diode laser bars

Thomas Westphalen, Stefan Hengesbach, Carlo Holly, Martin Traub, Dieter Hoffmann

Proc. SPIE. 8965, High-Power Diode Laser Technology and Applications XII

KEYWORDS: Optical components, Lenses, High power lasers, Laser applications, Semiconductor lasers, Collimators, Optical alignment, High power diode lasers, Algorithm development, Electroluminescent displays

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Proceedings Article | 7 March 2014 Paper

High-power dense wavelength division multiplexing (HP-DWDM) of frequency stabilized 9xx diode laser bars with a channel spacing of 1.5 nm

Stefan Hengesbach, Carlo Holly, Niels Krauch, Ulrich Witte, Thomas Westphalen, Martin Traub, Dieter Hoffmann

Proc. SPIE. 8965, High-Power Diode Laser Technology and Applications XII

KEYWORDS: Mirrors, High power lasers, Laser development, Multiplexing, Semiconductor lasers, Laser stabilization, Dense wavelength division multiplexing, Multiplexers, Dielectric mirrors, Temperature metrology

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Proceedings Article | 22 February 2012 Paper

Highly precise and robust packaging of optical components

Michael Leers, Matthias Winzen, Erik Liermann, Heinrich Faidel, Thomas Westphalen, Jörn Miesner, Jörg Luttmann, Dieter Hoffmann

Proc. SPIE. 8244, Laser-based Micro- and Nanopackaging and Assembly VI

KEYWORDS: Packaging, Thermography, Optical components, Aerospace engineering, LIDAR, Resistance, Laser welding, Tolerancing, Temperature metrology, Laser systems engineering

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Proceedings Article | 24 February 2009 Paper

High wall-plug efficiency diode lasers with an Al-free active region at 975 nm

N. Michel, M. Calligaro, Y. Robert, M. Lecomte, O. Parillaud, M. Krakowski, T. Westphalen, M. Traub

Proc. SPIE. 7198, High-Power Diode Laser Technology and Applications VII

KEYWORDS: Quantum wells, Transparency, Continuous wave operation, Waveguides, High power lasers, Gallium arsenide, Reflectivity, Semiconductor lasers, Aluminum, Internal quantum efficiency

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Proceedings Article | 24 February 2009 Paper

Investigation of n-side cooling in regards to bar geometry and packaging style of diode laser

Michael Leers, Thomas Westphalen, Rajiv Pathak, Christian Scholz

Proc. SPIE. 7198, High-Power Diode Laser Technology and Applications VII

KEYWORDS: Packaging, Resonators, Metals, Copper, Resistance, Laser welding, Semiconductor lasers, Laser resonators, High power diode lasers, Temperature metrology

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Proceedings Article | 24 February 2009 Paper

Packaging influence on laser bars of different dimensions

Thomas Westphalen, Michael Leers, Marcel Werner, Martin Traub, Hans-Dieter Hoffmann, Ralf Ostendorf

Proc. SPIE. 7198, High-Power Diode Laser Technology and Applications VII

KEYWORDS: Packaging, Resonators, Polarization, High power lasers, Reliability, Laser development, Resistance, Electroluminescence, Semiconductor lasers, Laser resonators

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Proceedings Article | 24 February 2009 Paper

Automated assembly of fast-axis collimation (FAC) lenses for diode laser bar modules

Jörn Miesner, Andre Timmermann, Jens Meinschien, Bernhard Neumann, Steve Wright, Tolga Tekin, Henning Schröder, Thomas Westphalen, Felix Frischkorn

Proc. SPIE. 7198, High-Power Diode Laser Technology and Applications VII

KEYWORDS: Optical components, Imaging systems, Cameras, Image processing, Ultraviolet radiation, Semiconductor lasers, Near field, Collimation, Micro optics, Laser systems engineering

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Proceedings Article | 13 February 2008 Paper

Emitter resolved analysis of packaged laser bars

Thomas Westphalen, Michael Leers, Christian Scholz, Konstantin Boucke

Proc. SPIE. 6876, High-Power Diode Laser Technology and Applications VI

KEYWORDS: Packaging, Polarization, Copper, Indium, Reliability, Laser applications, Resistance, Laser welding, Electroluminescence, Semiconductor lasers

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Proceedings Article | 8 February 2007 Paper

Next generation of cooling approaches for diode laser bars

Michael Leers, Konstantin Boucke, Christian Scholz, Thomas Westphalen

Proc. SPIE. 6456, High-Power Diode Laser Technology and Applications V

KEYWORDS: Packaging, Diamond, Polarization, Copper, Composites, Laser applications, Resistance, Corrosion, Semiconductor lasers, Single crystal X-ray diffraction

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Showing 5 of 11 publications

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