General algorithms of contour tracing are just for binary image, and fail in some complicated images. These algorithms are correct just in some ordinary cases. The reasons of failing are always the lack of theory and the pixel is not enough for contour tracing. The theory of crack brought by A.Rosenfeld is very useful for contour tracing. But the crack is not intuitionistic. So, a new pixel-based algorithm of contour tracing for multi-value segmented image is presented by using the character of crack. After analyzing all cases that maybe occur in contour tracing, this paper summarized a succinct theory. As we know, the contours maybe superpose and intersect, so the same pixel maybe occurs several times in contour tracing, but the corresponding crack is unique, if we find the crack, then the corresponding pixel is found. That is the idea of the paper. The new algorithm is easy and accurate compared the traditional algorithms. In addition, this paper analyzed all relations that maybe occur between regions, pointed a effective algorithm of analyzing the inclusion relations among the regions to build the tree structure. The former algorithms fail in analyzing the tree structure of multi-value segmented image, but the algorithm is effective in all case. Experiments show that these algorithms are correct and high-effective.
Automated reticle identification faces new challenges as the industry approaches the arrival of 300 mm wafer fabs and the possible introduction of 230 mm reticles. Data Matrix is a useful and established encoding format, and is proposed as a successor to current barcode formats. The Data Matrix feasibility experiment is described and results discussed.
There are ever increasing technical and business demands on the mask industry, resulting in increasing costs and cycle times. The support infrastructure continues to lack the ability to provide solutions to mask makers in a timely manner, due to its inability to recover its investment quickly. This further constraints the development resourcing necessary to stay on the Moore's Law Curve. At the same time, the mask industry has not provided a clearly focused set of demands on the equipment suppliers beyond the SIA Roadmap. This paper has taken the approach of collecting key mask metric technology requirements from the entire International SEMATECH mask community as a comparison to the SIA Roadmap requirements through to the 100 nm technology node. The results of that information identify gaps in mask-making technology by metric and process flow, prioritize the key issues, and offer potential solutions to these issues. Mask costs are addressed and challenged.
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