Mr. Thorsten Temme Profile

Thorsten Temme

at Laser Zentrum Hannover eV

SPIE Involvement:

Author

Publications (10)

Proceedings Article | 12 April 2005 Paper

Coincident multiwavelength irradiation of polymers with UV and VUV laser

Thorsten Temme, Andreas Ostendorf, Uwe Stute

Proceedings Volume 5713, (2005) https://doi.org/10.1117/12.592410

KEYWORDS: Laser ablation, Pulsed laser operation, Ultraviolet radiation, Polymethylmethacrylate, Vacuum ultraviolet, Absorption, Polymers, Quantum cascade lasers, Laser processing, Foam

Read Abstract +

In this paper the material ablation of polymers with a cascade of two laser pulses of different UV-wavelengths, exploiting the effects of the excited state absorption (ESA), is described. With a first vacuum ultraviolet (VUV) laser pulse with a wavelength of λ = 157 nm, the material is excited at low energy densities. A second, ultraviolet (UV) laser pulse, either λ = 193 nm or λ = 248 nm, is applied with a defined time delay between Δτ = 0 and 200 ns to the first pulse to induce the ablation process. Experiments have been carried out on polymethyl methacrylate (PMMA) and polytetrafluorethylene (PTFE). The effects on the ablation quality, ablation threshold and the ablation rate have been investigated. The focus has been set on the range of low energy densities, aiming for minimum ablation by each single laser pulse. By applying the multi wavelength pulse trains, the ablation quality can be improved, compared to the conventional UV laser machining of such materials. The machining of PMMA with a cascade of λ = 157 and λ = 248 nm does not show the material foaming, which can be observed when applying only λ = 248 nm laser pulses in the low energy regime. Applied on PTFE, the multi wavelength ablation shows improved results when using λ = 157 nm and λ = 193 nm, compared to the pure λ = 193 nm processing. The excited state increases the absorption of the UV laser light in the material, allowing a minimised ablation rate or higher depth resolution. This can be reduced down to the range of some nm (PMMA) or a few ten nm (PTFE). Besides the fluence, the time delay Δτ has been identified as a process parameter to vary the ablation rate. Also this dependency is qualitatively not unique for all wavelength, material and fluence combinations, but most of the experimental data point out an increased sensitivity for time delays between Δτ = 30 and Δτ = 60 ns. This sensitivity correlates with the time resolved temperature course on the surface, which is induced by the excitation pulse.

Proceedings Article | 8 October 2004 Paper

Laser spot welding of electronic micro parts

Andreas Ostendorf, Thorsten Temme, Jeihad Zeadan

Proceedings Volume 5662, (2004) https://doi.org/10.1117/12.596353

KEYWORDS: Lead, Signal processing, Signal detection, Sensors, Laser welding, Copper, Optical filters, Packaging, Nd:YAG lasers, Metals

Read Abstract +

Proceedings Article | 8 October 2004 Paper

The influence of physical characteristics on ablation effects in UV laser assisted micro engineering

Andreas Ostendorf, Christian Kulik, Thorsten Temme, Frank Otte, Katja Samm

Proceedings Volume 5662, (2004) https://doi.org/10.1117/12.596754

KEYWORDS: Laser ablation, Metals, Copper, Molybdenum, Tantalum, Pulsed laser operation, Nickel, Iron, Thermography, Tungsten

Read Abstract +

Proceedings Article | 2 April 2004 Paper

Precision shaping of transparent materials for optical devices with VUV laser radiation

Thorsten Temme, Andreas Ostendorf, Christian Kulik

Proceedings Volume 5399, (2004) https://doi.org/10.1117/12.552744

KEYWORDS: Optical components, Laser ablation, Silica, Nitrogen, Diffractive optical elements, Diffraction gratings, Excimer lasers, Pulsed laser operation, Vacuum ultraviolet, Lenses

Read Abstract +

Proceedings Article | 18 November 2003 Paper

Sapphire tools for laser-assisted microforming

Jens Wulfsberg, Sven-Eric Hilpert, Andreas Ostendorf, Christian Kulik, Thorsten Temme, Katja Samm

Proceedings Volume 5063, (2003) https://doi.org/10.1117/12.541442

KEYWORDS: Sapphire, Metals, Excimer lasers, Helium, Aluminum, Sapphire lasers, Manufacturing, Ultraviolet radiation, Laser processing, Transmittance

Read Abstract +

Proceedings Article | 18 November 2003 Paper

Machining of optical microstructures with 157 nm laser radiation

Thorsten Temme, Andreas Ostendorf, Christian Kulik

Proceedings Volume 5063, (2003) https://doi.org/10.1117/12.540527

KEYWORDS: Laser ablation, Silica, Nitrogen, Diffraction gratings, Optical components, Atmospheric optics, Diffractive optical elements, Excimer lasers, Lenses, Pulsed laser operation

Read Abstract +

Proceedings Article | 17 October 2003 Paper

Precision drilling of fused silica with 157-nm excimer laser radiation

Thorsten Temme, Andreas Ostendorf, Christian Kulik, Klaus Meyer

Proceedings Volume 4977, (2003) https://doi.org/10.1117/12.479557

KEYWORDS: Laser drilling, Silica, Excimer lasers, Plasma, Gas lasers, Laser ablation, Absorption, Glasses, Quartz, Carbon monoxide

Read Abstract +

Proceedings Article | 25 February 2002 Paper

Precision machining of innovative materials using 157-nm excimer laser radiation

Andreas Ostendorf, Uwe Stamm, Thorsten Temme

Proceedings Volume 4426, (2002) https://doi.org/10.1117/12.456905

KEYWORDS: Silica, Laser ablation, Excimer lasers, Fluorine, Laser applications, Refractive index, Quartz, Glasses, Waveguides, Microfabrication

Read Abstract +

Proceedings Article | 29 June 2001 Paper

Short-pulse and short-wavelength ablation of semiconductor materials

Andreas Ostendorf, Thorsten Bauer, Thorsten Temme, Thilo Wagner

Proceedings Volume 4274, (2001) https://doi.org/10.1117/12.432503

KEYWORDS: Silicon, Laser ablation, Semiconductor lasers, Absorption, Semiconductors, Femtosecond phenomena, Photons, Vacuum ultraviolet, Electrons, Excimer lasers

Read Abstract +

Proceedings Article | 25 August 2000 Paper

Flexible processing of large scale LCD panels using scanner-deflected UV-laser radiation

Andreas Ostendorf, Klaus Koerber, Thorsten Temme, Bob Bann, Paul Apte, Heinz Haberzettl, Tatjana Budischewski

Proceedings Volume 4174, (2000) https://doi.org/10.1117/12.396441

KEYWORDS: LCDs, Manufacturing, Indium, Tin, Oxides, Scanners

Read Abstract +

Showing 5 of 10 publications

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years