In this contribution we show through via drillings in dielectrics by ultrafast laser top-down percussion drilling in GHzburst mode. We point out some limitations that occur during the drilling process and show how to overcome these. Finally, we obtained through vias of almost constant diameter in Sodalime glass, which might be of interest in the microelectronics industry for the fabrication of glass interposers.
Femtosecond laser processing in GHz-burst mode has attracted much attention. Here, we report on dielectrics cutting with a spatially and temporally shaped femtosecond laser beam using a Bessel beam in the GHz-burst regime. In this contribution, we report on the influence of the number of pulses per burst as well as the pulse duration of the individual pulses within the burst. The resulting surface roughness of the cutting planes is measured as a function of the cutting parameters to evaluate the cutting quality.
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