Dr. Uzodinma Okoroanyanwu
Research Associate Professor
SPIE Involvement:
Editorial Board Member: Journal of Micro/Nanolithography, MEMS, and MOEMS | Editorial Board Member: Journal of Micro/Nanopatterning, Materials, and Metrology | Author | Instructor
Websites:
Profile Summary

Uzodinma Okoroanyanwu is a research associate professor in the department of polymer science and engineering of University of Massachusetts at Amherst. His research interests are broadly geared toward the application of electrochemistry, materials science, and lithography to the development of electronic instruments and materials used in electrochemical energy storage; multi-parametric sensing; printed, flexible, flexible/hybrid and wearable electronics; and electromagnetic interference shielding. He is also the founder of Enx Labs, a company that translates his research results into devices and instruments that help to improve the human condition and sustain the environment. He worked previously at Advanced Micro Devices, where he spent 12 years conducting research on advanced lithography and on organic polymer memories, and at GLOBALFOUNDRIES, where he spent 4 years conducting research on advanced lithography. He has published extensively on lithography science and technology and on electronic applications of polymers. His books include "Chemistry and Lithography, 2nd ed, Vol. 1: The Chemical History of Lithography" (SPIE Press, 2020); "Molecular Theory of Lithography" (SPIE Press, 2015); and "Chemistry and Lithography" (SPIE Press & John-Wiley & Sons, 2010). A holder of 37 U.S patents, he was educated at The University of Texas at Austin, where he earned the following degrees: Ph.D. physical chemistry (1997), M.S. chemical engineering (1995), M.A. physical chemistry (1994), B.S. Chemistry and Chemical engineering (1991).
Publications (42)

SPIE Press Book | 4 February 2020

SPIE Press Book | 17 December 2015
KEYWORDS: Polymers, Lithography, Molecules, Polymerization, Optical lithography, Polymer thin films, Ions, Photoresist processing, Diffusion

Proceedings Article | 30 June 2012 Paper
Proc. SPIE. 8441, Photomask and Next-Generation Lithography Mask Technology XIX
KEYWORDS: Contamination, Particles, Coating, Manufacturing, Inspection, Reflectivity, Photomasks, Extreme ultraviolet, Ruthenium, Mask cleaning

Proceedings Article | 17 April 2012 Paper
Proc. SPIE. 8352, 28th European Mask and Lithography Conference
KEYWORDS: Mirrors, Defect detection, Inspection, Reflectivity, Scanning electron microscopy, Optical inspection, Photomasks, Extreme ultraviolet, Semiconducting wafers, Defect inspection

Proceedings Article | 20 April 2011 Paper
Proc. SPIE. 7971, Metrology, Inspection, and Process Control for Microlithography XXV
KEYWORDS: Lithography, Deep ultraviolet, Polarization, Scattering, Etching, Light scattering, Inspection, Bridges, Extreme ultraviolet, Semiconducting wafers

Showing 5 of 42 publications
Conference Committee Involvement (10)
Extreme Ultraviolet (EUV) Lithography VII
22 February 2016 | San Jose, California, United States
Extreme Ultraviolet (EUV) Lithography VI
23 February 2015 | San Jose, California, United States
Extreme Ultraviolet (EUV) Lithography V
24 February 2014 | San Jose, California, United States
Extreme Ultraviolet (EUV) Lithography IV
25 February 2013 | San Jose, California, United States
Extreme Ultraviolet (EUV) Lithography III
13 February 2012 | San Jose, California, United States
Showing 5 of 10 Conference Committees
Course Instructor
SC1099: Chemistry and Lithography
This course, based on the next edition of the book with the same title, explores the chemical basis of advanced lithography, which in all its essential aspects is about chemical transformations that are designed to print a relief image of an object on a flat surface. The object may be a mask containing patterns of integrated circuit devices; the flat surface may be a silicon wafer coated with photo- or radiation-sensitive resist, which upon exposure and development, or imprinting (as in the case of imprint resists), or directed self-assembly (as in the case of block copolymer resists), is transformed into the relief image of the mask. Underlying these transformations are distinct chemical reactions that are mediated by electrons. By drawing on fundamental, theoretical and experimental studies of molecular processes in advanced lithography, we will deconstruct lithography into its essential chemical principles. We will examine and show how electrons mediate the photo- and radiation chemistry of exposure processes of resists (be they organic, organometallic, polymeric or inorganic), as well as exposure tool sources (be they mercury arc lamp, laser, electron beam, ion beam, or plasma); colloid chemistry of resist formulation and dissolution (be it for positive tone or negative tone development), wafer and mask cleaning processes; electrochemistry of mask absorber corrosion, electrostatic discharge, and electromigration; surface chemistry of wafer and mask priming, along with thin film interfacial effects; materials chemistry of resists, exposure tool optics, and masks; environmental chemistry of the exposure environment (be it water, air or vacuum), as well as of resist poisoning; process chemistry and modeling of wafer and mask making lithographic unit operations, including substrate priming, coating, exposure, pre- and post-exposure baking, development, and post-exposure stabilization processes; inorganic and organometallic chemistry of mask defect formation and repair, of mask contamination from inorganic salt (haze) crystal growth, carbon deposition and oxidation; and polymer chemistry of directed block copolymer self-assembly.
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