Dr. Viorel Dragoi
Chief Scientist Permanent Wafer Bonding at EV Group GmbH
SPIE Involvement:
Author
Publications (13)

Proceedings Article | 14 June 2017 Paper
Proc. SPIE. 10246, Smart Sensors, Actuators, and MEMS VIII
KEYWORDS: Microelectromechanical systems, Mirrors, Light emitting diodes, Metals, Annealing, Copper, Interfaces, Diffusion, Solids, Microelectronics, Semiconducting wafers, Wafer bonding, Liquids, Tin

Proceedings Article | 21 May 2015 Paper
Proc. SPIE. 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems
KEYWORDS: Microelectromechanical systems, Gold, Sensors, Metals, Glasses, Annealing, Silicon, Manufacturing, Semiconducting wafers, Wafer bonding

Proceedings Article | 17 May 2013 Paper
Proc. SPIE. 8763, Smart Sensors, Actuators, and MEMS VI
KEYWORDS: Microelectromechanical systems, Metals, Copper, Interfaces, Scanning electron microscopy, Deposition processes, Semiconducting wafers, Wafer bonding, Liquids, Tin

Proceedings Article | 17 May 2013 Paper
Proc. SPIE. 8763, Smart Sensors, Actuators, and MEMS VI
KEYWORDS: Particles, Control systems, Transducers, Process control, Cavitation, Acoustics, Semiconducting wafers, Wafer testing, Wafer bonding, Surface finishing

Proceedings Article | 5 May 2011 Paper
Proc. SPIE. 8066, Smart Sensors, Actuators, and MEMS V
KEYWORDS: Microelectromechanical systems, Oxides, Contamination, Metals, Annealing, Interfaces, Manufacturing, Semiconducting wafers, Adhesives, Wafer bonding

Showing 5 of 13 publications
Conference Committee Involvement (4)
Smart Sensors, Actuators, and MEMS VIII
8 May 2017 | Barcelona, Spain
Smart Sensors, Actuators, and MEMS VII
4 May 2015 | Barcelona, Spain
Smart Sensors, Actuators, and MEMS VI
24 April 2013 | Grenoble, France
Smart Sensors, Actuators and MEMS
18 April 2011 | Prague, Czech Republic
SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top