Experiments are presented that investigate the mechanistic cause of multilayer erosion observed from condenser optics exposed to EUV laser-produced plasma (LPP) sources. Using a Xe filament jet source excited with Nd-YAG laser radiation (300 mJ/pulse), measurements were made of material erosion from Au, Mo, Si and C using coated quartz microbalances located 127 mm from the plasma. The observed erosion rates were as follows: Au=99nm/106 shots, Mo= 26nm/106 shots, Si=19nm/106 shots, and C=6nm/106 shots. The relative ratio Au:Mo:Si:C of erosion rates observed experimentally, 16:4:3:1 compares favorably with that predicted from an atomic sputtering model assuming 20 kV Xe ions, 16:6:4:1. The relative agreement indicates that Xe-substrate sputtering is largely responsible for the erosion of Mo/Si multilayers on condenser optics that directly face the plasma. Time-of-flight Faraday cup measurements reveal the emission of high energy Xe ions from the Xe-filament jet plasma. The erosion rate does not depend on the repetition rate of the laser, suggesting a thermal mechanism is not operative. The Xe-filament jet erosion is ~20x that observed from a Xe spray jet. Since the long-lived (millisecond time scale) plasma emanating from these two sources are the same to within ~30%, sputtering from this long-lived plasma can be ruled out as an erosion agent.
Differently prepared Ru-capping layers, deposited on Mo/Si EUV multilayers, have been characterized using a suite of metrologies to establish their baseline structural, optical, and surface properties in as-deposited state. The same capping layer structures were tested for their thermal stability and oxidation resistance. Post-mortem characterization identified changes due to accelerated tests. The best performing Ru-capping layer structure was studied in detail with transmission electron microscopy to identify the grain microstructure and texture. This information is essential for modeling and performance optimization of EUVL multilayers.
Transmission measurements of niobium and zirconium at both extreme-ultraviolet (EUV) and ultraviolet, visible, and near infrared (UV/Vis/NIR) wavelengths are presented. Thin foils of various thicknesses mounted on nickel mesh substrates were measured, and these data were used to calculate the optical constants delta and beta of the complex refractive index n = 1- δ + iβ. β values were calculated directly from the measured transmittance of the foils after normalizing for the nickel mesh. The average beta values for each set of foils are presented as a function of wavelength. The real (dispersive) part of the refractive index, delta was then calculated from Kramers-Kronig analysis by combining these beta values with those from previous experimental data and the atomic tables.
Silicon capped [Mo/Si] multilayer mirrors (MLM’s) can undergo oxidation by the combined effects of radiation (Extreme Ultraviolet [EUV], electron) and water vapor. This parametric study provides silicon-capped MLM oxidation rate data. The goal of this study was to determine the dependence of silicon oxidation on water vapor pressure and radiation flux density over three orders of magnitude. Previous work1 has shown that electron and 95.3 eV EUV exposures produce similar oxidation. The present study verifies that correlation and examines the effects of EUV and electron flux on the oxidation rate of the Si-capping layer. E-beam and EUV exposed areas on silicon-capped MLM samples were analyzed following radiation exposure by Auger depth profiling to determine the thickness of the oxide grown. A ruthenium (Ru) capped MLM was also exposed for 4-hours, however it showed very little oxidation under the most extreme conditions of our test matrix. Also the effect of varying the primary e-beam voltage (0.5-2.0 keV) on Si-capped MLM was examined, which showed that exposures in the 1-2 keV range produce similar results.
The EUV Engineering Test Stand (ETS) is a full field, alpha class Extreme Ultraviolet Lithography (EUVL) tool that has demonstrated the printing of 70 nm resolution scanned images. The tool employs
Mo/Si multilayer optics that reflect EUV radiation (13.4nm / 92.5eV) with ~67% peak reflectance per optic. For good reflectivity, many (greater than or equal to 40)Mo/Si layers must be present. Consequently, processes such as plasma induced multilayer erosion, which reduces the number of bilayer pairs on plasma facing optics, need to be understood. Since most materials readily absorb EUV photons, it is important to prevent contamination of mirror surfaces with EUV absorbing material. Contamination can occur by EUV photons “cracking” hydrocarbons or other species absorbed on the optical surfaces. The first ETS condenser component, referred to as C1, is coated with Mo/Si multilayers. Data collected from Mo/Si witness plates placed at the C1 position indicate erosion, using the Xe Laser Produced Plasma (LPP) spray jet, of 1 bilayer per ~15 million shots. Preliminary experiments with a filament jet yielded a significantly higher erosion rate. In the spray jet studies, erosion was found to depend sensitively on the composition of the residual background environment. Addition of low levels, ~7x10-7 Torr, of H2O to the vacuum background produced oxidation of the Si cap, and significantly slowed spray jet induced erosion. Operation of the plasma changed the environment in the Illuminator Chamber from oxidizing to carbonizing, thereby changing the nature of the contamination found environment at the C3 optic which does not view the plasma directly (and therefore does not erode). The change in environment is attributed to plasma induced outgassing of fluorocarbons in the Illuminator. Due to the non zero conductance
between the Illuminator and Main Chambers, fluorocarbons were also found in the Main Chamber during Xe LPP operation. RGA data are presented that document the effect. In the presence of such outgassing, Carbon deposition rates were measured for the C3, and P.O. Box optics. For C3, a C deposition rate of 3 angstrom / 10 million shots was found, while for the PO Box, a C deposition rate of 0.02 angstrom / 10 million shots was found from the data. All data was acquired with no attempt to mitigate C deposition with gas phase additives such as O2.
Extreme ultraviolet (EUV)-induced oxidation of silicon-capped, [Mo/Si] multilayer mirrors in the presence of background levels of water vapor is recognized as one of the most serious threats to multilayer lifetime since oxidation of the top silicon layer is an irreversible process. The current work directly compares the oxidation on a silicon-capped, [Mo/Si] multilayers caused by EUV photons with the oxidation caused by 1 keV electrons in the presence of the same water vapor environment (2 x 10-6 Torr). Similar, 4 nm, silicon-capped, [Mo/Si] multilayer mirror samples were exposed to photons (95.3 eV) + water vapor at the ALS, LBNL, and also to a 1 keV electron beam + water vapor in separate experimental systems. The results of this work showed that the oxidation produced by ~1 µA of e-beam current was found to be equivalent to that produced by ~1 mW of EUV exposure. These results will help allow the use of 1 keV electrons beams, instead of EUV photons, to perform environmental testing of multilayers in a low-pressure water environment and to more accurately determine projected mirror lifetimes based on the electron beam exposures.
The development of defect-free reticle blanks is an important challenge facing the commercialization of extreme ultraviolet lithography (EUVL). The basis of an EUVL reticle are mask blanks consisting of a substrate and a reflective Mo/Si multilayer. Defects on the substrate or defects introduced during multilayer deposition can result in critical phase and amplitude defects. Amplitude- or phase-defect repair techniques are being developed with the goal to repair many of these defects. In this paper we discuss the selection of a capping layer for amplitude-defect repair, and report on experimental results of the reflectance variation over the amplitude-defect repair zone for different capping layers. Our results suggest that carbon and silicon carbide are the leading candidates for capping layer materials. We further performed a quantitative assessment of the yield improvement due to defect repair. We found that amplitude- and phase-defect repair have the potential to significantly improve mask blank yield, and that yield can be maximized by increasing the number of Mo/Si bilayers.
Recent studies have been conducted to investigate the use of atomic hydrogen as an in-situ contamination removal method for EUV optics. In these experiments, a commercial source was used to produce atomic hydrogen by thermal dissociation of molecular hydrogen using a hot filament. Samples for these experiments consisted of silicon wafers coated with sputtered carbon, Mo/Si optics with EUV-induced carbon, and bare Si-capped and Ru-B4C-capped Mo/Si optics. Samples were exposed to an atomic hydrogen source at a distance of 200 - 500 mm downstream and angles between 0-90° with respect to the source. Carbon removal rates and optic oxidation rates were measured using Auger electron spectroscopy depth profiling. In addition, at-wavelength peak reflectance (13.4 nm) was measured using the EUV reflectometer at the Advanced Light Source. Data from these experiments show carbon removal rates up to 20 Å/hr for sputtered carbon and 40 Å/hr for EUV deposited carbon at a distance of 200 mm downstream. The cleaning rate was also observed to be a strong function of distance and angular position. Experiments have also shown that the carbon etch rate can be increased by a factor of 4 by channeling atomic hydrogen through quartz tubes in order to direct the atomic hydrogen to the optic surface. Atomic hydrogen exposures of bare optic samples show a small risk in reflectivity degradation after extended periods. Extended exposures (up to 20 hours) of bare Si-capped Mo/Si optics show a 1.2% loss (absolute) in reflectivity while the Ru-B4C-capped Mo/Si optics show a loss on the order of 0.5%. In order to investigate the source of this reflectivity degradation, optic samples were exposed to atomic deuterium and analyzed using low energy ion scattering direct recoil spectroscopy to determine any reactions of the hydrogen with the multilayer stack. Overall, the results show that the risk of over-etching with atomic hydrogen is much less than previous studies using RF discharge cleaning while providing cleaning rates suitable for EUV lithography operations.
The performance of Mo/Si multilayer mirrors (MLMs) used to reflect UV (EUV) radiation in an EUV + hydrocarbon (NC) vapor environment can be improved by optimizing the silicon capping layer thickness on the MLM in order to minimize the initial buildup of carbon on MLMs. Carbon buildup is undesirable since it can absorb EUV radiation and reduce MLM reflectivity. A set of Mo/Si MLMs deposited on Si wafers was fabricated such that each MLM had a different Si capping layer thickness ranging form 2 nm to 7 nm. Samples from each MLM wafer were exposed to a combination of EUV light + (HC) vapors at the Advanced Light Source (ALS) synchrotron in order to determine if the Si capping layer thickness affected the carbon buildup on the MLMs. It was found that the capping layer thickness had a major influence on this 'carbonizing' tendency, with the 3 nm layer thickness providing the best initial resistance to carbonizing and accompanying EUV reflectivity loss in the MLM. The Si capping layer thickness deposited on a typical EUV optic is 4.3 nm. Measurements of the absolute reflectivities performed on the Calibration and Standards beamline at the ALS indicated the EUV reflectivity of the 3 nm-capped MLM was actually slightly higher than that of the normal, 4 nm Si-capped sample. These results show that he use of a 3 nm capping layer represents an improvement over the 4 nm layer since the 3 nm has both a higher absolute reflectivity and better initial resistance to carbon buildup. The results also support the general concept of minimizing the electric field intensity at the MLM surface to minimize photoelectron production and, correspondingly, carbon buildup in a EUV + HC vapor environment.
The EUV Engineering Test Stand (ETS) has demonstrated the printing of 100 nm resolution scanned images. This milestone was achieved with the ETS operating in an initial low-power configuration using a 40 W laser combined with a Xe cluster jet. The third condenser component is referred to as 'C3' illuminator optics was removed after this low-power operation, and extensively characterized for EUV-induced contamination. EUV reflectivity data indicate a decrease in reflectivity from an initial 66 percent to approximately 48- 56 percent, with the more intensely illuminated areas of the C3 having the smaller final reflectivity. Auger electron spectroscopy indicated the observed reflectivity decrease can be largely attributed to carbon contamination, approximately 150-300 Angstrom thick depending on location. No evidence was found for optic oxidation, indicating EtOH successfully prevented EUV/H2O oxidation of the outermost Si layer during exposure to both EUV and out-of- band radiation. Measurements of the reflectivity centroid wavelength shoed a negligible change, suggesting the observed variations were due to surface contaminating and not bulk multilayer radiation damage. The carbon contamination could be removed by RF-O2 cleaning.
EUV mask blanks are fabricated by depositing a reflective Mo/Si multilayer film onto super-polished substrates. Small defects in this thin film coating can significantly alter the reflected field and introduce defects in the printed image. Ideally one would want to produce defect-free mask blanks; however, this may be very difficult to achieve in practice. One practical way to increase the yield of mask blanks is to effectively repair multilayer defects, and to this effect we present two complementary defect repair strategies for use on multilayer-coated EUVL mask blanks. A defect is any area on the mask which causes unwanted variations in EUV dose in the aerial image obtained in a printing tool, and defect repair is correspondingly defined as any strategy that renders a defect unprintable during exposure. The term defect mitigation can be adopted to describe any strategy which renders a critical defect non-critical when printed, and in this regard a non-critical defect is one that does not adversely affect device function. Defects in the patterned absorber layer consist of regions where metal, typically chrome, is unintentionally added or removed from the pattern leading to errors in the reflected field. There currently exists a mature technology based on ion beam milling and ion beam assisted deposition for repairing defects in the absorber layer of transmission lithography masks, and it is reasonable to expect that these this technology will be extended to the repair of absorber defects in EUVL masks . However, techniques designed for the repair of absorber layers can not be directly applied to the repair of defects in the mask blank, and in particular the multilayer film. In this paper we present for the first time a new technique for the repair of amplitude defects as well as recent results on the repair of phase defects.
Commercial EUV lithographic systems require multilayers with higher reflectance and better stability then that published to date. This work represents our effort to meet these specifications. Interface-engineered Mo/Si multilayers with 70% reflectance at 13.5 nm wavelength (peak width of 0.545 nm) and 71% at 12.7 nm wavelength (peak width of 0.49 nm) were developed. These results were achieved with 50 bilayers. These new multilayers consist of Mo and Si layers separated by thin boron carbide layers. Depositing boron carbide on interfaces leads to reduction in silicide formation of the Mo-on-Si interfaces. Bilayer contraction is reduced by 30% implying that there is less intermixing of Mo and Si to form silicide. As a result the Mo-on-Si interfaces are sharper in interface-engineered multilayers than in standard Mo/Si multilayers. The optimum boron carbide thicknesses have been determined and appear to be different for Mo-on-Si and Si-on-Mo interfaces. The best results were obtained with 0.4 nm thick boron carbide layer for the Mo-on-Si interface and 0.25 nm thick boron carbide layer for the Si-on-Mo interface. Increase in reflectance is consistent with multilayers with sharper and smoother interfaces. A significant improvement in oxidation resistance of EUV multilayers has been achieved with ruthenium terminated Mo/Si multilayers. The best capping layer design consists of a Ru layer separated from the last Si layer by a boron carbide diffusion barrier. This design achieves high reflectance and the best oxidation resistance in a water vapor (i.e. oxidation) environment. Electron beam exposures of 4.5 hours in the presence of 5x10-7 torr water vapor partial pressure show no measurable reflectance loss and no increase in the oxide thickness of Ru terminated multilayers. Longer exposures in different environments are necessary to test lifetime stability of many years.
Carbon deposition and removal experiments on Mo/Si multilayer mirror (MLM) samples were performed using extreme ultraviolet (EUV) light on Beamline 220.127.116.11 of the Advanced Light Source, Lawrence Berkeley National Laboratory (LBNL). Carbon (C) was deposited onto Mo/Si multilayer mirror (MLM) samples when hydrocarbon vapors where intentionally introduced into the MLM test chamber in the presence of EUV at 13.44 nm (92.3eV). The carbon deposits so formed were removed by molecular oxygen + EUV. The MLM reflectivities and photoemission were measured in-situ during these carbon deposition and cleaning procedures. Auger Electron Spectroscopy (AES) sputter-through profiling of the samples was performed after experimental runs to help determine C layer thickness and the near-surface compositional-depth profiles of all samples studied. EUV powers were varied from ~0.2mW/mm2 to 3mW/mm2(at 13.44 nm) during both deposition and cleaning experiments and the oxygen pressure ranged from ~5x10-5 to 5x10-4 Torr during the cleaning experiments. C deposition rates as high as ~8nm/hr were observed, while cleaning rates as high as ~5nm/hr could be achieved when the highest oxygen pressure were used. A limited set of experiments involving intentional oxygen-only exposure of the MLM samples showed that slow oxidation of the MLM surface could occur.
The first environmental data from the Engineering Test Stand (ETS) has been collected. Excellent control of high-mass hydrocarbons has been observed. This control is a result of extensive outgas testing of components and materials, vacuum compatible design of the ETS, careful cleaning of parts and pre-baking of cables and sub assemblies where possible, and clean assembly procedures. As a result of the hydrocarbon control, the residual ETS vacuum environment is rich in water vapor. Analysis of witness plate data indicates that the ETS environment does not pose a contamination risk to the optics in the absence of EUV irradiation. However, with EUV exposure, the water rich environment can lead to EUV- induced water oxidation of the Si-terminated Mo/Si optics. Added ethanol can prevent optic oxidation, allowing carbon growth via EUV cracking of low-level residual hydrocarbons to occur. The EUV environmental issues are understood, mitigation approaches have been validated, and EUV optic contamination appears to be manageable.
Various passivating agents that reduce the surface leakage current of CZT crystals have been previously reported. In none of the studies, NH4F/H2O2 was identified as a promising passivation agent for CZT. We now present a study that includes the effect of NH4F/H2O2 treatment on the surface properties and detector performance. An elemental depth profile was obtained via Auger Electron Spectroscopy. Furthermore, X-ray Photoelectron Spectroscopy acquired at different processing times to identify the chemical states of the elemental species that composed the dielectric layer. It was found that the NH4F/H2O2 surface passivation significantly improved the sensitivity and energy resolution of CZT detectors. Furthermore, the NH4F/H2O2 treatment did not attack the Au electrodes, which eliminated the need to protect the contacts in the detector fabrication process.
Extreme Ultraviolet Lithography (EUVL) is a candidate for future application by the semiconductor industry in the production of sub-100 nm feature sizes in integrated circuits. Using multilayer reflective coatings optimized at wavelengths ranging from 11 to 14 nm, EUVL represents a potential successor to currently existing optical lithography techniques. In order to assess lifetimes of the multilayer coatings under realistic conditions, a series of radiation stability tests has been performed. In each run a dose of EUV radiation equivalent to several months of lithographic operation was applied to Mo/Si and Mo/Be multilayer coatings within a few days. Depending on the residual gas concentration in the vacuum environment, surface deposition of carbon during the exposure lead to losses in the multilayer reflectivity. However, in none of the experimental runs was structural damage within the bulk of the multilayers observed. Mo/Si multilayer coatings recovered their full original reflectivity after removal of the carbon layer by an ozone cleaning method. Auger depth profiling on Mo/Be multilayers indicate that carbon penetrated into the Be top layer during illumination with high doses of EUV radiation. Subsequent ozone cleaning fully removed the carbon, but revealed enhanced oxidation of the area illuminated, which led to an irreversible loss in reflectance on the order of 1%.