Mr. Weiping Liu Profile

Weiping Liu

at Univ of South Carolina

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Publications (4)

Proceedings Article | 10 April 2007 Paper

Finite element simulation of piezoelectric wafer active sensors for structural health monitoring with coupled-filed elements

Weiping Liu, Victor Giurgiutiu

Proceedings Volume 6529, 65293R (2007) https://doi.org/10.1117/12.715238

KEYWORDS: Finite element methods, Structural health monitoring, Sensors, Wave propagation, Optical simulations, Active sensors, Chemical elements, 3D modeling, Semiconducting wafers, Wave plates

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Crack detection with piezoelectric wafer active sensors (PWAS) is emerging as an effective and powerful technique in structural health monitoring (SHM). Modeling and simulation of PWAS and host structure play an important role in the SHM applications with PWAS. For decades finite element method has been extensively applied in the analysis of piezoelectric materials and structures. The advantage of finite element analysis over analytical solutions is that stress and electrical field measurements of complex geometries, and their variations throughout the device, are more readily calculated. FEM allows calculation of the stress and electric field distributions under static loads and under any applied electrical frequency, and so the effect of device geometry can be assessed and optimized without the need to manufacture and test numerous devices. Coupled field analysis taking both mechanical motions and electrical characteristics into account should all be employed to provide a systemic overview of the piezoelectric sensors/actuators (even arrays of them) and the host structures. This use of PWAS for SHM has followed two main paths: (a). Wave propagation (b). Electromechanical impedance; Previous research has shown that PWAS can detect damage using wave reflections, changes in wave signature, or changes in the electromechanical (E/M) impedance spectrum. The primary goal of this paper is to investigate the use of finite element method (FEM) to simulate various SHM methods with PWAS. For the simulation of Electro-mechanical (E/M) impedance technique, simple models, like free PWAS of different shapes and 1-dimmension beam with PWAS are investigated and the simulated structural E/M impedance was presented. For the wave propagation SHM technique, a long beam with several PWAS installed was studied. One PWAS is excited by tone burst signals and elastic wave will propagate along the beam. The existence of a crack will affect the structure integrity and the echo reflected by crack can be observed through the simulations. By using the coupled field elements, direct simulation of electro-mechanical interaction of the PWAS and the host structure was made possible. The electrical potential generated on the PWAS surface by the stimulation of elastic wave can be examined in our FEM analysis. The simulation results are then compared to analytical calculation and experimental data.

Proceedings Article | 11 April 2006 Paper

Finite element modeling and simulation of piezoelectric wafer active sensors interaction with the host structure for structural health monitoring

Weiping Liu, Victor Giurgiutiu

Proceedings Volume 6174, 61742Z (2006) https://doi.org/10.1117/12.658501

KEYWORDS: Structural health monitoring, Finite element methods, Sensors, Wave propagation, Optical simulations, Active sensors, 3D modeling, Semiconducting wafers, Chemical elements, Wave plates

Read Abstract +

Crack detection with piezoelectric wafer active sensors (PWAS) is emerging as an effective and powerful technique in structural health monitoring (SHM). Modeling and simulation of PWAS and host structure play an important role in the SHM applications with PWAS. For decades finite element method has been extensively applied in the analysis of piezoelectric materials and structures. The advantage of finite element analysis over analytical solutions is that stress and electrical field measurements of complex geometries, and their variations throughout the device, are more readily calculated. FEM allows calculation of the stress and electric field distributions under static loads and under any applied electrical frequency, and so the effect of device geometry can be assessed and optimized without the need to manufacture and test numerous devices. Coupled field analysis taking both mechanical motions and electrical characteristics into account should all be employed to provide a systemic overview of the piezoelectric sensors/actuators (even arrays of them) and the host structures. This use of PWAS for SHM has followed two main paths: (a). Wave propagation (b). Electromechanical impedance; Previous research has shown that PWAS can detect damage using wave reflections, changes in wave signature, or changes in the electromechanical (E/M) impedance spectrum. The primary goal of this paper is to investigate the use of finite element method (FEM) to simulate various SHM methods with PWAS. For the simulation of Electro-mechanical (E/M) impedance technique, simple models, like free PWAS of different shapes and 1-dimmension beam with PWAS are investigated and the simulated structural E/M impedance was presented. For the wave propagation SHM technique, a long beam with several PWAS installed was studied. One PWAS is excited by tone burst signals and mechanical wave will propagate along the beam. The existence of a crack will affect the structure integrity and the echo reflected by crack can be observed through the simulations.

Proceedings Article | 17 May 2005 Paper

Development of specifications for an integrated piezoelectric wafer active sensors system

Christopher Jenkins, Victor Giurgiutiu, Bin Lin, Weiping Liu

Proceedings Volume 5764, (2005) https://doi.org/10.1117/12.599877

KEYWORDS: Sensors, Semiconducting wafers, Switches, Transducers, Capacitance, Structural health monitoring, Ultrasonics, Active sensors, Waveguides, Oscilloscopes

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Proceedings Article | 17 May 2005 Paper

Automation of data collection for PWAS-based structural health monitoring

Weiping Liu, Victor Giurgiutiu

Proceedings Volume 5765, (2005) https://doi.org/10.1117/12.598200

KEYWORDS: Structural health monitoring, Switching, LabVIEW, Oscilloscopes, Relays, Signal generators, Switches, Transducers, Sensors, Connectors

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