Will Wang
at KLA Corp
SPIE Involvement:
Author
Publications (2)

Proceedings Article | 12 November 2024 Presentation + Paper
Alice Fu, Howard Lin, Calvin Hung, Bing-Rui Li, Ellis Lu, Jerry Hsieh, Brandon Hurt, Ryan Carlson, Xinya Liu, Masaki Satake, Derui Li, Will Wang, Wallace Wang, Brian Du, Daojing Li, Yao Zhang, Zeyu Lei, Narayani Narasimhan, Daniel Price, Vikram Tolani
Proceedings Volume 13215, 1321509 (2024) https://doi.org/10.1117/12.3033686
KEYWORDS: Reticles, Semiconducting wafers, Defect inspection, Wafer inspection, High volume manufacturing, Extreme ultraviolet, Scanning electron microscopy, Extreme ultraviolet lithography, Printing, Manufacturing

Proceedings Article | 23 October 2020 Presentation + Paper
Proceedings Volume 11518, 115180Q (2020) https://doi.org/10.1117/12.2573765
KEYWORDS: Photomasks, Reticles, Analytics, Manufacturing, Inspection, Semiconducting wafers, Process control, Etching, Metrology, Overlay metrology

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