Prof. William P. King Profile

Prof. William P. King

at Georgia Institute of Technology

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Publications (4)

SPIE Journal Paper | 1 April 2007

Nanoscale thermal lithography by local polymer decomposition using a heated atomic force microscope cantilever tip

Yueming Hua, Shubham Saxena, Clifford Henderson, William King

JM3, Vol. 6, Issue 02, 023012, (April 2007) https://doi.org/10.1117/12.10.1117/1.2743374

KEYWORDS: Polymers, Polymer thin films, Lithography, Optical lithography, Atomic force microscope, Metrology, Scanning probe lithography, Silicon, In situ metrology, Silicon films

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Proceedings Article | 21 March 2007 Paper

Direct three-dimensional nanoscale thermal lithography at high speeds using heated atomic-force microscope cantilevers

Clifford Henderson, Yueming Hua, William King, Jung Lee, Shubham Saxena

Proceedings Volume 6517, 65171L (2007) https://doi.org/10.1117/12.713374

KEYWORDS: Polymers, Polymer thin films, Lithography, Modulation, Electron beam lithography, Atomic force microscopy, Atomic force microscope, Optical lithography, Manufacturing, Silicon

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Proceedings Article | 31 March 2006 Paper

Nanolithography in thermally sacrificial polymers using nanoscale thermal probes

William King, Clifford Henderson, Shubham Saxena, Yueming Hua

Proceedings Volume 6153, 61531G (2006) https://doi.org/10.1117/12.661803

KEYWORDS: Polymers, Lithography, Optical lithography, Nanolithography, Crystals, Thin films, Atomic force microscope, Glasses, Resistance, Atomic force microscopy

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Proceedings Article | 20 May 2004 Paper

Microsystems manufacturing via embossing of photodefinable thermally sacrificial materials

Celesta White, Travis Anderson, William King, Clifford Henderson, Harry Rowland

Proceedings Volume 5374, (2004) https://doi.org/10.1117/12.536277

KEYWORDS: Polymers, Silicon, Microfluidics, Manufacturing, Lithography, Microelectromechanical systems, Scanning electron microscopy, Semiconducting wafers, Etching, Microsystems

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Substantial recent interest in microelectronics manufacturing has motivated significant work on non-traditional processes such as embossing-based lithography. This work has been generally limited to manufacturing conventional microelectronics, producing two dimensional patterned surfaces and structures. To date, little work has been done to produce microelectromechanical systems (MEMS), which can require production of complex three-dimensional and possibly free standing structures. This paper reports a novel method for manufacturing three-dimensional microstructures that can be freely standing and/or fully released. The method involves the use of thermally sacrificial polymers, i.e. materials that can be cleanly decomposed to gaseous products upon heating at elevated temperatures. Such sacrificial polymers can be directly embossed and subsequently overcoated with a variety of materials including other polymers, dielectrics, semiconductors, and metals. Following the deposition of the overcoat layer, further processing can be performed on the overcoat layer (e.g. selective etching or deposition of additional materials). Finally, the entire structure is heated to the decomposition temperature of the sacrificial polymer which results in the “dry” removal of the sacrificial layer, thus releasing the desired structures. The various sacrificial materials that have been investigated are polynorbornenes and polycarbonates, and the overlayer materials include polyimides, silicon oxide, and metals. This paper discusses the various properties of these sacrificial materials, the printing and processing conditions for these materials, and the use of this method for the fabrication of a MEMS based microfluidic system with free standing and suspended obstructions. This novel manufacturing technique meets the needs of MEMS manufacturing in that it can produce three dimensional and free standing microstructures. It permits the fabrication of devices and systems in only a few process steps that would otherwise be either substantially more complicated or impossible to achieve. This process of coating, embossing, and overcoating can also be repeated to build-up complex multi-layered structures.

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