Mr. Yanghui Liu Profile

Yanghui Liu

at KLA China

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Publications (7)

Proceedings Article | 23 August 2021 Paper

The application of reticle analyzer in DRAM fab

Asei Chou, Wenhao Hsu, Andy Lan, Jason Fang, Claire Lu, Harper Yu, Zeyu Lei, Catherine Li, Steven Liu, Vikram Tolani

Proceedings Volume 11908, 119080V (2021) https://doi.org/10.1117/12.2598020

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In modern advanced IC fabs, reticle management is essential for process control and yield management, since any reticle issue can potentially impact thousands of wafers, resulting in a huge economic loss. For reticle caused issues, the possibility of human mistakes made in defect disposition has dramatically increased as the defects on reticles become more complicated. The difficulty in defect disposition originates from smaller critical dimension (CD) and complex pattern designs like aggressive OPC and SRAF. Conventionally, defect disposition after reticle inspection is done by operators or engineers, and defects are evaluated based on engineers’ experience or AIMS tool, which are high risk and time-consuming methods. Use of automated defect disposition solutions has been reported in some photomask shops, but in DRAM fabs, an efficient and accurate defect disposition system is not yet present. In collaboration with KLA, Changxin Memory Technology (CXMT) accessed and utilized KLA’s Reticle Analyzer (RA), an intuitive web-based analysis interface that integrates Automatic Defect Classification (ADC), Lithographic Printability Review (LPR), and Defect Progress Monitor (DPM) to overcome reticle defect disposition difficulties. The comprehensive analytics tool systematically disposes all defects detected by KLA reticle inspection systems, eliminating human error in defect classification and providing 99.5% accuracy without under-classifying any defects. Furthermore, CXMT studied the LPR solution for multiple critical layers with programmed-defect masks, then verified the simulated LPR results in CD error (CDE). The correlation between LPR results and wafer printing results shows accurate CDE prediction in high volume production. Additionally, DPM was used to generate statistical process control like charts for reticle defectivity. This study shows that the integrated RA software offers a modern solution for wafer fabs that automates reticle defect management and shortens time to decision for engineers.

Proceedings Article | 26 September 2019 Presentation + Paper

Demonstrating the value of integrated reticle automation solutions in high volume wafer fab manufacturing

Frank CM Wu, Chin Kuei Chang, Yousheng Yin, Jeffery Liang, Chain Ping Chen, Wei Chen, Donghwan Song, Jinghua Zeng, Kunal Rohilla, Alexander Tan, Yanghui Liu

Proceedings Volume 11148, 111481O (2019) https://doi.org/10.1117/12.2536788

KEYWORDS: Reticles, Photomasks, Semiconducting wafers, Manufacturing, Inspection, Resolution enhancement technologies, Optical proximity correction, SRAF

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Proceedings Article | 17 October 2008 Paper

SL2+: H5 use case

Kosuke Ito, Steven Liu, Isaac Lee, Russell Dover, Paul Yu

Proceedings Volume 7122, 71223N (2008) https://doi.org/10.1117/12.802333

KEYWORDS: Inspection, Photomasks, Reticles, Sensors, Contamination, Semiconducting wafers, SRAF, Stars, Algorithm development, Defect detection

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Proceedings Article | 19 May 2008 Paper

Implementation of new reticle inspection technology for progressive mask defect detection strategy in wafer fabs

Cathy Liu, Alex Lu, Crystal Wang, Eric Guo, Dongsheng Fan, Lisa Yun, Steven Liu, Raj Badoni, Eric Lu

Proceedings Volume 7028, 70282D (2008) https://doi.org/10.1117/12.793087

KEYWORDS: Inspection, Reticles, Photomasks, Semiconducting wafers, SRAF, Air contamination, Defect detection, Contamination, Modulation, Image transmission

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Proceedings Article | 19 May 2008 Paper

Comparison of TeraStar SL1, TeraScanHR DDR, DDT and SL2 to identify an efficient mask re-qualification inspection mode for 7Xnm half pitch design node production reticles in advanced memory wafer fab

Koji Kaneko, Takanobu Kobayashi, Jinggang Zhu, Norihiko Takatsu, Paul Yu, Kosuke Ito, Toshiaki Kojima, Yoshinori Nagaoka

Proceedings Volume 7028, 70282M (2008) https://doi.org/10.1117/12.793092

KEYWORDS: Inspection, Reticles, Photomasks, Air contamination, Semiconducting wafers, Product engineering, Defect detection, Photomask technology, Crystals, Quartz

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Proceedings Article | 1 November 2007 Paper

Implementation of an efficient defect classification method in photomask mass production

Cathy Liu, Crystal Wang, Skin Zhang, Eric Guo, Steven Liu, Eric Haodong Lu, Dongsheng Fan, Den Wang, Weiming Ma

Proceedings Volume 6730, 67303P (2007) https://doi.org/10.1117/12.747189

KEYWORDS: Photomasks, Inspection, Reticles, Defect inspection, Logic, Crystals, Optical proximity correction, Defect detection, Lithography, Contamination

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Proceedings Article | 25 October 2007 Paper

Optimizing defect inspection strategy through the use of design-aware database control layers

Dvori Stoler, Wayne Ruch, Weimin Ma, Swapnajit Chakravarty, Steven Liu, Ray Morgan, John Valadez, Bill Moore, John Burns

Proceedings Volume 6730, 67303L (2007) https://doi.org/10.1117/12.747302

KEYWORDS: Inspection, Photomasks, Databases, Manufacturing, Defect inspection, Semiconducting wafers, Mask making, Computed tomography, Optical proximity correction, Control systems

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Showing 5 of 7 publications

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