Ms. Yen-Jen Chen Profile

Yen-Jen Chen

at GlobalFoundries

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Publications (5)

Proceedings Article | 20 March 2018 Presentation + Paper

Overlay control for 7nm technology node and beyond

Nyan Aung, Woong Jae Chung, Pavan Samudrala, Haiyong Gao, Wenle Gao, Darius Brown, Guanchen He, Bono Park, Michael Hsieh, Xueli Hao, Yen-Jen Chen, Yue Zhou, DeNeil Park, Karsten Gutjahr, Ian Krumanocker, Kevin Jock, Juan Manuel Gomez

Proceedings Volume 10587, 105870A (2018) https://doi.org/10.1117/12.2295828

KEYWORDS: Overlay metrology, Semiconducting wafers, Optical alignment, Reticles, High volume manufacturing, Metrology, HVAC controls, Optimization (mathematics), Scanners, Extreme ultraviolet

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Proceedings Article | 28 March 2017 Paper

Enhanced methodology of focus control and monitoring on scanner tool

Yen-Jen Chen, Young Ki Kim, Xueli Hao, Juan-Manuel Gomez, Ye Tian, Ferhad Kamalizadeh, Justin Hanson

Proceedings Volume 10145, 101452K (2017) https://doi.org/10.1117/12.2258125

KEYWORDS: Scanners, Diffraction, Metrology, Semiconducting wafers, Process control, Calibration, Reticles, Overlay metrology, Critical dimension metrology, Lithography

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As the demand of the technology node shrinks from 14nm to 7nm, the reliability of tool monitoring techniques in advanced semiconductor fabs to achieve high yield and quality becomes more critical. Tool health monitoring methods involve periodic sampling of moderately processed test wafers to detect for particles, defects, and tool stability in order to ensure proper tool health. For lithography TWINSCAN scanner tools, the requirements for overlay stability and focus control are very strict. Current scanner tool health monitoring methods include running BaseLiner to ensure proper tool stability on a periodic basis. The focus measurement on YIELDSTAR by real-time or library-based reconstruction of critical dimensions (CD) and side wall angle (SWA) has been demonstrated as an accurate metrology input to the control loop. The high accuracy and repeatability of the YIELDSTAR focus measurement provides a common reference of scanner setup and user process. In order to further improve the metrology and matching performance, Diffraction Based Focus (DBF) metrology enabling accurate, fast, and non-destructive focus acquisition, has been successfully utilized for focus monitoring/control of TWINSCAN NXT immersion scanners. The optimal DBF target was determined to have minimized dose crosstalk, dynamic precision, set-get residual, and lens aberration sensitivity. By exploiting this new measurement target design, ~80% improvement in tool-to-tool matching, >16% improvement in run-to-run mean focus stability, and >32% improvement in focus uniformity have been demonstrated compared to the previous BaseLiner methodology. Matching <2.4 nm across multiple NXT immersion scanners has been achieved with the new methodology of set baseline reference. This baseline technique, with either conventional BaseLiner low numerical aperture (NA=1.20) mode or advanced illumination high NA mode (NA=1.35), has also been evaluated to have consistent performance. This enhanced methodology of focus control and monitoring on multiple illumination conditions, opens an avenue to significantly reduce Focus-Exposure Matrix (FEM) wafer exposure for new product/layer best focus (BF) setup.

Proceedings Article | 24 March 2017 Paper

Alignment solutions on FBEOL layers using ASML scanners

Pavan Samudrala, Gregory Hart, Yen-Jen Chen, Lokesh Subramany, Haiyong Gao, Nyan Aung, Woong Jae Chung, Blandine Minghetti, Rajan Mali, Seva Khikhlovskyi, Pieter Heres

Proceedings Volume 10147, 101471T (2017) https://doi.org/10.1117/12.2258128

KEYWORDS: Optical alignment, Sensors, Scanners, Aluminum, Near infrared, Laser beam diagnostics

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Proceedings Article | 24 March 2016 Paper

Focus control enhancement and on-product focus response analysis methodology

Young Ki Kim, Yen-Jen Chen, Xueli Hao, Pavan Samudrala, Juan-Manuel Gomez, Mark Mahoney, Ferhad Kamalizadeh, Justin Hanson, Shawn Lee, Ye Tian

Proceedings Volume 9778, 97780T (2016) https://doi.org/10.1117/12.2213019

KEYWORDS: Error analysis, High volume manufacturing, Semiconducting wafers, Metrology, Process control, Control systems, Scanners, Diffraction, Time metrology, Forward error correction, Lithography, Critical dimension metrology

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Proceedings Article | 8 March 2016 Paper

Overlay optimization for 1x node technology and beyond via rule based sparse sampling

Nyan Aung, Woong Jae Chung, Lokesh Subramany, Shehzeen Hussain, Pavan Samudrala, Haiyong Gao, Xueli Hao, Yen-Jen Chen, Juan-Manuel Gomez

Proceedings Volume 9778, 97782G (2016) https://doi.org/10.1117/12.2218161

KEYWORDS: Overlay metrology, Metrology, Process control, Statistical modeling, Semiconducting wafers, Scanners, Data centers, MATLAB, Manganese, Semiconductor manufacturing, High volume manufacturing

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