An innovative system structure was proposed including a linear probes device, an automatic optical registration system, a chamber-based gas supply system, a chuck table integrated with a heating device to efficiently evaluate the quality of sensors chips. The chamber-based gas supply system provided required gas concentration at the probing region. A chuck table integrated with a heating device to provide required uniform temperature was integrated to motion stage platform. An AOR system was implemented for registration of wafer automatically and adjustment of a linear probes device. Developed equipment had several advantages:(1) Registration process of wafer could be completed automatically within 50 seconds; (2) Required gas concentration could be quickly achieved within 60 seconds at testing region to save a lot of time and gas consumption; (3) Measurement could be finished within 30 minutes for a 6”-wafer with chip size of 1x1 mm under the condition of 10 chips probed for each time. The measuring efficiency was at least up to 10 times greater than the one of testing one by one for packaged sensors.
We present a portable non-contact displacement sensor (NCDS) based on astigmatic method for micron displacement measurement. The NCDS are composed of a collimated laser, a polarized beam splitter, a 1/4 wave plate, an aspheric objective lens, an astigmatic lens and a four-quadrant photodiode. A visible laser source is adopted for easier alignment and usage. The dimension of the sensor is limited to 115 mm x 36 mm x 56 mm, and a control box is used for dealing with signal and power control between the sensor and computer. The NCDS performs micron-accuracy with ±30 μm working range and the working distance is constrained in few millimeters. We also demonstrate the application of the NCDS for lens centration error measurement, which is similar to the total indicator runout (TIR) or edge thickness difference (ETD) of a lens measurement using contact dial indicator. This application has advantage for measuring lens made in soft materials that would be starched by using contact dial indicator.
The poker chip assembly with high precision lens barrels is widely applied to ultra-high performance optical system. ITRC applies the poker chip assembly technology to the high numerical aperture objective lenses and lithography projection lenses because of its high efficiency assembly process. In order to achieve high precision lens cell for poker chip assembly, an alignment turning system (ATS) is developed. The ATS includes measurement, alignment and turning modules. The measurement module is equipped with a non-contact displacement sensor (NCDS) and an autocollimator (ACM). The NCDS and ACM are used to measure centration errors of the top and the bottom surface of a lens respectively; then the amount of adjustment of displacement and tilt with respect to the rotational axis of the turning machine for the alignment module can be determined. After measurement, alignment and turning processes on the ATS, the centration error of a lens cell with 200 mm in diameter can be controlled within 10 arcsec. Furthermore, a poker chip assembly lens cell with three sub-cells is demonstrated, each sub-cells are measured and accomplished with alignment and turning processes. The lens assembly test for five times by each three technicians; the average transmission centration error of assembly lens is 12.45 arcsec. The results show that ATS can achieve high assembly efficiency for precision optical systems.
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