Dr. Young-Sik Kim Profile

Dr. Young-Sik Kim

at SK Hynix Inc

SPIE Involvement:

Author

Publications (21)

Proceedings Article | 20 March 2020 Paper

Paper

Improving after-etch overlay performance using high-density in-device metrology in DRAM manufacturing

Ik-Hyun Jeong, Seung-Woo Koo, Hyun-Sok Kim, Jung-Il Hwang, Dong-Jin Lee, Min-Shik Kim, Jae-Wuk Ju, Kang-Min Lee, Young-Sik Kim, Cees Lambregts, Rizvi Rahman, Marc Hauptmann, Raheleh Pishkari, Allwyn Boustheen, Kwang-Young Hu, Paul Böcker, Dong-Hak Lee, In-Ho Joo, Kang-San Lee

Proceedings Volume 11325, 113252X (2020) https://doi.org/10.1117/12.2552028

KEYWORDS: Overlay metrology, Etching, Inspection, Semiconducting wafers, Metrology, Feedback loops, Scanners, Spatial frequencies, High volume manufacturing

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Proceedings Article | 20 March 2019 Presentation + Paper

Presentation + Paper

Scanner and etch co-optimized corrections for better overlay and CD control

Ik-Hyun Jeong , Seung-Woo Koo, Hyun-Sok Kim, Jae-Wuk Ju, Young-Sik Kim, Yong-Tae Cho, Heung-Joo Kim, Katja Viatkina, Tom van Hemert, Ruud de Wit, David Deckers, Owen Chen, Nang-Lyeom Oh, Marcus Musselman, Marcus Carbery, Ssuwei Chen, Lucian Schmidt, Heidi Kwon, Jae Gyoo Lee

Proceedings Volume 10963, 1096308 (2019) https://doi.org/10.1117/12.2516578

KEYWORDS: Etching, Overlay metrology, Scanners, Semiconducting wafers, Metrology, Critical dimension metrology, Lithography, Plasma, Process control, Optical lithography

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Proceedings Article | 20 March 2019 Presentation + Paper

Presentation + Paper

Improved wafer alignment model algorithm for better on-product overlay

Ik-Hyun Jeong, Hyun-Sok Kim, Yeong-Oh Kong, Ji-Hyun Song, Jae-Wuk Ju, Young-Sik Kim, Cees Lambregts, Miao Yu, Rizvi Rahman, Leendertjan Karssemeijer, Elliott McNamara, Paul Böcker, Jong-Cheol Choi, Nang-Lyeom Oh, Kang-San Lee, Jin-Seo Lee

Proceedings Volume 10961, 109610A (2019) https://doi.org/10.1117/12.2516259

KEYWORDS: Optical alignment, Semiconducting wafers, Calibration, Data modeling, Overlay metrology, Metrology, Scanners, High volume manufacturing, Lithography, Sensors

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Proceedings Article | 13 March 2018 Presentation + Paper

Presentation + Paper

Unique method for controlling device level overlay with high-NA optical overlay technique using YieldStar in a DRAM HVM environment

Dong-Kiu Park, Hyun-Sok Kim, Moo-Young Seo, Jae-Wuk Ju, Young-Sik Kim, Mir Shahrjerdy, Arno van Leest, Aileen Soco, Giacomo Miceli, Jennifer Massier, Elliott McNamara, Paul Hinnen, Paul Böcker, Nang-Lyeom Oh, Sang-Hoon Jung, Yvon Chai, Jun-Hyung Lee

Proceedings Volume 10585, 105850V (2018) https://doi.org/10.1117/12.2297094

KEYWORDS: Overlay metrology, Metrology, Semiconducting wafers, Control systems, Manufacturing, Etching, Lithography, Critical dimension metrology, Inspection

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Proceedings Article | 13 March 2018 Paper

Paper

Accuracy optimization with wavelength tunability in overlay imaging technology

Honggoo Lee, Yoonshik Kang, Sangjoon Han, Kyuchan Shim, Minhyung Hong, Seungyoung Kim, Jieun Lee, Dongyoung Lee, Eungryong Oh, Ahlin Choi, Youngsik Kim, Tal Marciano, Dana Klein, Eitan Hajaj, Sharon Aharon , Guy Ben-Dov , Saltoun Lilach, Dan Serero, Anna Golotsvan

Proceedings Volume 10585, 1058532 (2018) https://doi.org/10.1117/12.2300153

KEYWORDS: Overlay metrology, Semiconducting wafers, Diffraction, Light sources, Imaging technologies, Integrated circuits, Visible radiation, Optical testing, Electromagnetism, Signal processing

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Proceedings Article | 13 March 2018 Presentation + Paper

Presentation + Paper

Computational metrology: enabling full-lot high-density fingerprint information without adding wafer metrology budget, and driving improved monitoring and process control

Hyun-Sok Kim, Min-Sung Hyun, Jae-Wuk Ju, Young-Sik Kim, Cees Lambregts, Peter van Rhee, Johan Kim, Elliott McNamara, Wim Tel, Paul Böcker, Nang-Lyeom Oh, Jun-Hyung Lee

Proceedings Volume 10585, 105851P (2018) https://doi.org/10.1117/12.2297182

KEYWORDS: Computational modeling, Metrology, Overlay metrology, Semiconducting wafers, Process control, Sensors, Optical alignment, Computing systems, Inspection, Manufacturing

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Proceedings Article | 30 March 2017 Paper

Paper

Process resilient overlay target designs for advanced memory manufacture

Joonseuk Lee, Mirim Jung, Honggoo Lee, Youngsik Kim, Sangjun Han, Michael Adel, Tal Itzkovich, Vladimir Levinski, Victoria Naipak, Anna Golotsvan, Amnon Manassen, Yuri Paskover, Tom Leviant, Efi Megged, Myungjun Lee, Mark Smith, Do-Hwa Lee, DongSub Choi, Zephyr Liu

Proceedings Volume 10145, 1014524 (2017) https://doi.org/10.1117/12.2258376

KEYWORDS: Overlay metrology, Metrology, Lithography, Manufacturing, Semiconducting wafers, Optical lithography, Polarization, Modulation, Critical dimension metrology, Image segmentation

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Proceedings Article | 24 March 2016 Paper

Paper

Lithography aware overlay metrology target design method

Myungjun Lee, Mark Smith, Joonseuk Lee, Mirim Jung, Honggoo Lee, Youngsik Kim, Sangjun Han, Michael Adel, Kangsan Lee, Dohwa Lee, Dongsub Choi, Zephyr Liu, Tal Itzkovich, Vladimir Levinski, Ady Levy

Proceedings Volume 9778, 97781L (2016) https://doi.org/10.1117/12.2218653

KEYWORDS: Overlay metrology, Metrology, Lithography, Scanners, Lithographic illumination, Personal protective equipment, Optical lithography, Resolution enhancement technologies, Optical proximity correction, Photomasks, SRAF

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Proceedings Article | 18 March 2016 Paper

Paper

Device overlay method for high volume manufacturing

Honggoo Lee, Sangjun Han, Youngsik Kim, Myoungsoo Kim, Hoyoung Heo, Sanghuck Jeon, DongSub Choi, Jeremy Nabeth, Irina Brinster, Bill Pierson, John Robinson

Proceedings Volume 9778, 97781F (2016) https://doi.org/10.1117/12.2219701

KEYWORDS: Overlay metrology, Scanning electron microscopy, Metrology, Inspection, High volume manufacturing, Image processing, Process control, Optical lithography, Control systems, Optical metrology, Semiconducting wafers, Data modeling, Transparency

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Proceedings Article | 18 March 2016 Paper

Paper

Study on RLS trade-off resist upgrade for production ready EUV lithography

Junghyung Lee, Jieun Kim, Seunguk Jeong, Mijung Lim, Sunyoung Koo, Chang-Moon Lim, Young-Sik Kim

Proceedings Volume 9776, 977623 (2016) https://doi.org/10.1117/12.2219558

KEYWORDS: Extreme ultraviolet, Manufacturing, Neodymium, Nanoimprint lithography, Extreme ultraviolet lithography, Ions, Source mask optimization, Ultraviolet radiation, Line edge roughness, Optical lithography

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Proceedings Article | 8 March 2016 Paper

Paper

Spacer multi-patterning control strategy with optical CD metrology on device structures

Jongsu Lee, Byoung-Hoon Lee, Won-Kwang Ma, Sang-Jun Han, Young-Sik Kim, Noh-Jung Kwak, Thomas Theeuwes, Wei Guo, Yi Song, Baukje Wisse, Stefan Kruijswijk, Hugo Cramer, Steven Welch, Alok Verma, Rui Zhang, Yvon Chai, Sharon Hsu, Giacomo Miceli, Kyu-Tae Sun, Jin-Moo Byun

Proceedings Volume 9778, 97782B (2016) https://doi.org/10.1117/12.2219664

KEYWORDS: Etching, Metrology, Process control, Control systems, Critical dimension metrology, Scatterometry, Optical lithography, Image processing, Scatter measurement, Measurement devices, Semiconducting wafers, Inspection

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Proceedings Article | 23 October 2015 Paper

Paper

Reduction of in-lot overlay variation with integrated metrology, and a holistic control strategy

Hong-Goo Lee, Sang-Jun Han, Won-Kwang Ma, Young-Sik Kim, Noh-Jung Kwak, Paul Böcker, David Deckers, Weitian Kou, Michiel Kupers, Kevin Ryan, Elliott McNamara, Gwang-Gon Kim, Kyu-Tae Sun, Young-Wan Lim, Jin-Moo Byun, Jung-Joon Suh

Proceedings Volume 9635, 96351S (2015) https://doi.org/10.1117/12.2196879

KEYWORDS: Semiconducting wafers, Metrology, Principal component analysis, Overlay metrology, Optical alignment, Immersion lithography, Time metrology, Scanners, Semiconductor manufacturing, Diffraction

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Proceedings Article | 7 April 2015 Paper

Paper

Understanding of stochastic noise

Seo-Min Kim, Chang-Moon Lim, Mi-Rim Jung, Young-Sik Kim, Won-Taik Kwon, Chang-Nam Ahn, Kyu-Tae Sun, Anita Fumar-Pici, Alek Chen

Proceedings Volume 9422, 94220M (2015) https://doi.org/10.1117/12.2087559

KEYWORDS: Stochastic processes, Photomasks, Absorption, Critical dimension metrology, Extreme ultraviolet, Immersion lithography, Lithography, Photoresist processing, Line width roughness, Particles

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Proceedings Article | 6 April 2015 Paper

Paper

EUV mask particle adders during scanner exposure

Yoonsuk Hyun, Jinsoo Kim, Kyuyoung Kim, Sunyoung Koo, SeoMin Kim, Youngsik Kim, Changmoon Lim, Nohjung Kwak

Proceedings Volume 9422, 94221U (2015) https://doi.org/10.1117/12.2085626

KEYWORDS: Photomasks, Particles, Scanners, Extreme ultraviolet lithography, Semiconducting wafers, Pellicles, Extreme ultraviolet, Inspection, Reticles, Scanning electron microscopy

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Proceedings Article | 19 March 2015 Paper

Paper

Improving full-wafer on-product overlay using computationally designed process-robust and device-like metrology targets

Young-Sik Kim, Young-Sun Hwang, Mi-Rim Jung, Ji-Hwan Yoo, Won-Taik Kwon, Kevin Ryan, Paul Tuffy, Youping Zhang, Sean Park, Nang-Lyeom Oh, Chris Park, Mir Shahrjerdy, Roy Werkman, Kyu-Tae Sun, Jin-Moo Byun

Proceedings Volume 9424, 942414 (2015) https://doi.org/10.1117/12.2085645

KEYWORDS: Overlay metrology, Metrology, Target detection, Semiconducting wafers, Optical proximity correction, Resolution enhancement technologies, Reticles, Lithography, Optical lithography, Etching

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Proceedings Article | 2 April 2014 Paper

Paper

CD uniformity optimization at volume ramp up stage for new product introduction

Jin-Soo Kim, Won-Kwang Ma, Young-Sik Kim, Myoung-Soo Kim, Won-Taik Kwon, Sung-Ki Park, Peter Nikolsky, Marian Otter, Maryana Escalante Marun, Roy Anunciado, Kyu-Tae Sun, Greet Storms, Ewould van West

Proceedings Volume 9050, 905037 (2014) https://doi.org/10.1117/12.2057390

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Yield improvement, Semiconductors, Etching, Photoresist processing, Optical lithography, Process control, Overlay metrology, Manufacturing

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Proceedings Article | 21 March 2006 Paper

Paper

Implementation of contact hole patterning performance with KrF resist flow process for 60nm node DRAM application

Hyoung-ryeun Kim, Yeong-Bae Ahn, JongKuk Kim, SeokKyun Kim, DongHeok Park, Young-Sik Kim

Proceedings Volume 6154, 615441 (2006) https://doi.org/10.1117/12.659398

KEYWORDS: Optical lithography, Photoresist processing, Photoresist materials, Semiconducting wafers, Lithography, Etching, Cadmium sulfide, Oxides, Lithographic illumination, Scanning electron microscopy

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Proceedings Article | 12 May 2005 Paper

Paper

Implementation of KrF 0.29 k1 lithography

Hyeong Soo Kim, Seok Kyun Kim, Young Sik Kim, Sang Man Bae, Dong Heok Park, Young Deuk Kim, Yoon Suk Hyun, Hyoung Reun Kim, Keun Kyu Kong, Min Seok Son, Yong Soon Jung, Bong Ho Choi

Proceedings Volume 5754, (2005) https://doi.org/10.1117/12.598610

KEYWORDS: Lithography, Photomasks, Optical lithography, Quartz, Optical proximity correction, Device simulation, Lithographic illumination, Manufacturing, Scanners, Photography

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Proceedings Article | 12 May 2005 Paper

Paper

Sub 90nm DRAM patterning by using modified chromeless PSM at KrF lithography era

Young-Sik Kim, Yoon-Suk Hyun, Keun-Kyu Kong, Hyeongsoo Kim, Bong-Ho Choi

Proceedings Volume 5754, (2005) https://doi.org/10.1117/12.599216

KEYWORDS: Optical lithography, Photomasks, Lithography, Semiconducting wafers, Printing, Electroluminescence, Mask making, Chromium, Process control, Photomicroscopy

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The Most chip makers want KrF lithography is extended below sub 90nm lithography due to cost and process stability, even though ArF lithography has been growing and its performance is enough to apply to 90nm node. But process control of KrF lithography will become difficult at sub 90nm node because of patterning limitation of KrF lithography. Specially, mask error factor (MEF) is growing to be important for patterning. Generally, chromeless phase shifting mask (PSM) has known widely as a good solution for better patterning than any other PSM, but there are a few companies to apply this mask to their process due to some fatal weakness which are design complexity, difficulties of mask making, control of mask defect, and so on. This paper shows the new modified chromeless HTPSM has solution for some special pattern by using KrF lithography and compares with strong aperture result at 90nm node. The most of island pattern has different MEF with width and length. And patterning control of length axis has been very difficult from mask making to wafer printing. In addition, its control is seriously depended on width axis in the low k1 level. Patterning of storage node contact which is 1:2 duty with width and length axis is very difficult in general DRAM pattern, its MEF is over 5 at width axis and over 15 at length axis in 90nm node. Both axis controls are too hard to achieve good patterning simultaneously. Generally, chromeless PSM has a good MEF performance so we apply and create new modified chromeless HTPSM to overcome our storage node contact pattern. This PSM consist of three layers which are 0° Qz, 180° Qz, and 360° half-tone pattern. 180° Qz pattern play important role in this PSM as a assist pattern to achieve good patterning. First of all, we should make a choice of optimum layout and then we decide on how to make a mask because it is very important factor to control overlay accuracy between 0° Qz and 180° Qz pattern. This overlay accuracy affect to patterning result seriously. Modified chromeless HTPSM has strong patterning performance but overlay accuracy between major and assist pattern will be controlled tightly. This reason is what we hesitate to apply modified chromeless HTPSM to real device development.

Proceedings Article | 26 June 2003 Paper

Paper

Printing 95-nm DRAM full chip patterns in KrF lithography

Seok-Kyun Kim, Jin-Soo Kim, Tae-Jun Yoo, Keun-Kyu Kong, Hyoung-Soon Yun, Young-Deuk Kim, Hyoung-Ryeun Kim, Young-Sik Kim, Hyeong-Soo Kim

Proceedings Volume 5040, (2003) https://doi.org/10.1117/12.485435

KEYWORDS: Lithography, Lithographic illumination, Photomasks, Photoresist processing, Printing, Etching, Semiconducting wafers, Critical dimension metrology, Forward error correction, Optical proximity correction

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Proceedings Article | 2 June 2003 Paper

Paper

Analysis of total CD uniformity at sub-100-nm DRAM patterning by using KrF lithography

Young-Sik Kim, Tae Jun You, Jin-Soo Kim, Seok-Kyun Kim, Keun-Kyu Kong, Young-Deuk Kim, HyeongSoo Kim

Proceedings Volume 5038, (2003) https://doi.org/10.1117/12.485009

KEYWORDS: Photomasks, Lithography, Semiconducting wafers, Optical lithography, Forward error correction, Chemical mechanical planarization, Lithographic illumination, Photoresist processing, Monochromatic aberrations, Critical dimension metrology

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Showing 5 of 21 publications

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