Plasma etch challenges and innovations to enable sub-26nm pitch L/S patterning with high-NA EUV

Nafees A. Kabir

doi:10.1117/12.2658512

30 April 2023 Plasma etch challenges and innovations to enable sub-26nm pitch L/S patterning with high-NA EUV

Nafees A. Kabir

Proceedings Volume PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII; PC124990G (2023) https://doi.org/10.1117/12.2658512
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

This conference presentation was prepared for the Advanced Etch Technology and Process Integration for Nanopatterning XII conference at SPIE Advanced Lithography + Patterning 2023.

Conference Presentation

Citation Download Citation

Nafees A. Kabir "Plasma etch challenges and innovations to enable sub-26nm pitch L/S patterning with high-NA EUV", Proc. SPIE PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, PC124990G (30 April 2023); https://doi.org/10.1117/12.2658512

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