Methods for fabrication of flexible hybrid electronics

Robert A. Street; Ping Mei; Brent Krusor; Steve E. Ready; Yong Zhang; David E. Schwartz; Adrien Pierre; Sean E. Doris; Beverly Russo; Siv Kor; Janos Veres

doi:10.1117/12.2275561

25 August 2017 Methods for fabrication of flexible hybrid electronics

Robert A. Street, Ping Mei, Brent Krusor, Steve E. Ready, Yong Zhang, David E. Schwartz, Adrien Pierre, Sean E. Doris, Beverly Russo, Siv Kor, Janos Veres

Author Affiliations +

Proceedings Volume 10366, Hybrid Memory Devices and Printed Circuits 2017; 103660C (2017) https://doi.org/10.1117/12.2275561
Event: SPIE Organic Photonics + Electronics, 2017, San Diego, California, United States

Abstract

Printed and flexible hybrid electronics is an emerging technology with potential applications in smart labels, wearable electronics, soft robotics, and prosthetics. Printed solution-based materials are compatible with plastic film substrates that are flexible, soft, and stretchable, thus enabling conformal integration with non-planar objects. In addition, manufacturing by printing is scalable to large areas and is amenable to low-cost sheet-fed and roll-to-roll processes. FHE includes display and sensory components to interface with users and environments. On the system level, devices also require electronic circuits for power, memory, signal conditioning, and communications. Those electronic components can be integrated onto a flexible substrate by either assembly or printing. PARC has developed systems and processes for realizing both approaches. This talk presents fabrication methods with an emphasis on techniques recently developed for the assembly of off-the-shelf chips. A few examples of systems fabricated with this approach are also described.

Citation Download Citation

Robert A. Street, Ping Mei, Brent Krusor, Steve E. Ready, Yong Zhang, David E. Schwartz, Adrien Pierre, Sean E. Doris, Beverly Russo, Siv Kor, and Janos Veres "Methods for fabrication of flexible hybrid electronics", Proc. SPIE 10366, Hybrid Memory Devices and Printed Circuits 2017, 103660C (25 August 2017); https://doi.org/10.1117/12.2275561

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