This work proves useful in predicting the range of mechanical and electronic properties of wafers cut from ingots that are grown on-axis. More specifically, by understanding the effect of the melt/solid growth interface on the physical properties on the crystal, growth conditions can be optimized to produce more electrically uniform wafers that minimize pixel-to-pixel variation in FPAs. |
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Crystals
Interfaces
Semiconducting wafers
Staring arrays
Solids
Chemical species
Supercooling