High Density Display/ Driver Interconnections Using Anisotropic CAIS: (Conductive Adhesive Interconnect System)

Roger R. Reinke

doi:10.1117/12.976413

25 July 1989 High Density Display/ Driver Interconnections Using Anisotropic CAIS: (Conductive Adhesive Interconnect System)

Roger R. Reinke

Author Affiliations +

Proceedings Volume 1080, Liquid Crystal Chemistry, Physics, and Applications; (1989) https://doi.org/10.1117/12.976413
Event: OE/LASE '89, 1989, Los Angeles, CA, United States

Abstract

New advances in the development and commercialization of Liquid Crystal Active Matrix Display products have increased the density of the rows and columns that must be electrically interfaced to the driver board. In the past the "Planar" type of conductive adhesive interconnect system (CAIS) having up to 80 connections per inch as depicted in Figure #1 were developed for the pocket TV sets and other Liquid Crystal Displays. The active matrix color displays now being developed require up to 164 connections per inch. To meet this challenge, a high density CAIS has been developed that also satisfies MIL-STD 810C requirements. This system differs from the "Planar" type in that it uses an Anisotropic Conductive Thermoset Film (AECT) at the bond area over conductive traces etched out of 9 micron copper foil laminated to Polyester base film.

Citation Download Citation

Roger R. Reinke "High Density Display/ Driver Interconnections Using Anisotropic CAIS: (Conductive Adhesive Interconnect System)", Proc. SPIE 1080, Liquid Crystal Chemistry, Physics, and Applications, (25 July 1989); https://doi.org/10.1117/12.976413

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