Casual modeling of yield

Jeffrey Weintraub; Scott Warrick

doi:10.1117/12.2515080

26 March 2019 Casual modeling of yield

Jeffrey Weintraub, Scott Warrick

Proceedings Volume 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII; 109592C (2019) https://doi.org/10.1117/12.2515080
Event: SPIE Advanced Lithography, 2019, San Jose, California, United States

Abstract

Industry standard yield models make no provision for the heterogeneity of defect density or indication of how the uncertainty of defect density is propagated to uncertainty of die per wafer yield. In this paper we show how standard models can be extended by causal analysis to improve their generality. Causal diagrams are employed to specify yield models and make their assumptions transparent. Worked examples are provided as well as all the open-source code needed for the analyses.

Citation Download Citation

Jeffrey Weintraub and Scott Warrick "Casual modeling of yield", Proc. SPIE 10959, Metrology, Inspection, and Process Control for Microlithography XXXIII, 109592C (26 March 2019); https://doi.org/10.1117/12.2515080

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