Paper
4 April 2019 Using machine learning in the physical modeling of lithographic processes
Author Affiliations +
Abstract
We show how combining machine learning with physical models can improve the overall accuracy of modeling the lithographic process for OPC applications by up to 40%. This level of model accuracy improvement is critical to meet the stringent requirements of the 5nm node and below. We demonstrate how the judicious design of the neural network can create a model capable of high accuracy and high contour quality, even when no contour data is available. This allows the neural network model to be introduced without disrupting the model calibration flow used in OPC.
© (2019) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kostas Adam, Shashidhara Ganjugunte, Clement Moyroud, Kostya Shchehlik, Michael Lam, Andrew Burbine, Germain Fenger, and Yuri Granik "Using machine learning in the physical modeling of lithographic processes", Proc. SPIE 10962, Design-Process-Technology Co-optimization for Manufacturability XIII, 109620F (4 April 2019); https://doi.org/10.1117/12.2519848
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Neural networks

Machine learning

Systems modeling

Optical proximity correction

Data modeling

Process modeling

Calibration

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