Fabrication tolerant planar directional couplers

C. K. Lai; Y. L. Zhong; T. Han; W. Y. Chong; D. Y. Choi; H. D. K. Goldsmith; P. Ma; H. Ahmad; S. Madden

doi:10.1117/12.2540497

30 December 2019 Fabrication tolerant planar directional couplers

C. K. Lai, Y. L. Zhong, T. Han, W. Y. Chong, D. Y. Choi, H. D. K. Goldsmith, P. Ma, H. Ahmad, S. Madden

Proceedings Volume 11200, AOS Australian Conference on Optical Fibre Technology (ACOFT) and Australian Conference on Optics, Lasers, and Spectroscopy (ACOLS) 2019; 1120033 (2019) https://doi.org/10.1117/12.2540497
Event: ANZCOP, 2019, Melbourne, Australia

Abstract

Hybrid integration of different materials will allow for different functionalities such as passive, amplifying, nonlinear, electro-optic, detection etc to build “system on a chip” devices. The vertically stacked layer design commonly proposed significantly increases the difficulty of the lithography process for the bottom-most layer due to the overlying topology. A methodology for significantly improving the fabrication tolerance of planar directional couplers is therefore presented. A parametric design study reveals that significant dimensional sensitivity improvements exist for certain center-to-center spacings for both power and wavelength splitters.

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C. K. Lai, Y. L. Zhong, T. Han, W. Y. Chong, D. Y. Choi, H. D. K. Goldsmith, P. Ma, H. Ahmad, and S. Madden "Fabrication tolerant planar directional couplers", Proc. SPIE 11200, AOS Australian Conference on Optical Fibre Technology (ACOFT) and Australian Conference on Optics, Lasers, and Spectroscopy (ACOLS) 2019, 1120033 (30 December 2019); https://doi.org/10.1117/12.2540497

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KEYWORDS

Waveguides

Directional couplers

Tolerancing

Physics

Wavelength division multiplexing

Lithography

Mach-Zehnder interferometers

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