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9 March 2020 Full-color LED integration based on adhesive bonding for micro-LED display applications (Conference Presentation)
Dong-Seon Lee
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Proceedings Volume 11302, Light-Emitting Devices, Materials, and Applications XXIV; 1130205 (2020) https://doi.org/10.1117/12.2537958
Event: SPIE OPTO, 2020, San Francisco, California, United States
Abstract
Recently, researches on the micro-displays using inorganic LEDs have stirred much attentions due to its various advantages such as reduced power consumption, long life time and short response time. In this study, we achieved a full-color integration of LEDs for display applications by combining growth and bonding technologies with two different approaches. First method was integrating inorganic red, green, and blue LEDs on a single substrate using metalorganic chemical vapor deposition and thin film bonding techniques. Second method was fabricating inorganic red, green, and blue LEDs by using GaN-on-Si-based blue LEDs and adhesive bonding.
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Dong-Seon Lee "Full-color LED integration based on adhesive bonding for micro-LED display applications (Conference Presentation)", Proc. SPIE 11302, Light-Emitting Devices, Materials, and Applications XXIV, 1130205 (9 March 2020); https://doi.org/10.1117/12.2537958
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KEYWORDS
Adhesives
LED displays
Light emitting diodes
Thin films
Blue light emitting diodes
RGB color model
Lithography
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