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8 March 2021 Comparison of ultrashort pulse laser ablation with GHz pulse bursts and MHz pulse bursts of metals, silicon, and dielectric materials
Stefan M. Remund, Markus A. Gafner, Michalina V. Chaja, Aivaras Urniežius, Simas Butkus, Beat Neuenschwander
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Proceedings Volume 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI; 116730C (2021) https://doi.org/10.1117/12.2583192
Event: SPIE LASE, 2021, Online Only
Abstract
We investigated GHz pulse bursts ablation on metals, silicon, zirconium dioxide, soda-lime glass and sapphire for surface structuring applications with a commercial laser system providing a burst pulse frequency of 5.4 GHz and a maximum of 25 pulses per burst pulse train. The results on metal show dramatic decrease of the ablation efficiency and a reduction of the machining quality. For silicon we also observed a reduction of the ablation efficiency for GHz pulse bursts but found a strong increase for MHz pulse bursts using a 10 ps laser system. On glass an increase of the ablation rate for GHz pulse bursts was observed, however with pure machining quality indicated by crakes in the surface and boarders. Zirconium oxide was the only investigated material, where a GHz pulse bursts induces a moderate higher ablation efficiency with comparable surface qualities, however a 10% higher ablation rate was obtained with a 10 ps laser system.
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Stefan M. Remund, Markus A. Gafner, Michalina V. Chaja, Aivaras Urniežius, Simas Butkus, and Beat Neuenschwander "Comparison of ultrashort pulse laser ablation with GHz pulse bursts and MHz pulse bursts of metals, silicon, and dielectric materials", Proc. SPIE 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI, 116730C (8 March 2021); https://doi.org/10.1117/12.2583192
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KEYWORDS
Laser ablation
Metals
Semiconductor lasers
Silicon
Dielectrics
Ultrafast phenomena
Laser systems engineering
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