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There are significant advantages for on-board and co-packaged optics in next-generation data centers. However, the highvolume manufacturing of the photonic circuits that underpin the technology will require the fabrication of large quantities on a wafer- or panel-scale, which must then be singulated into individual devices. A major challenge is the requirement for low-loss edge coupling to optical fibers (optical-quality and vertical end-facets) which typically requires expensive and time-consuming post-processing steps such as mechanical polishing. In this work, an ultrafast laser is employed to singulate glass substrates using a non-diffracting beam that creates a localized material modification through the entire glass thickness via nonlinear laser-material interactions. By controlling the placement of the laser modifications, the regions around the waveguides could be strategically avoided. This leaves optical-quality regions around the waveguides which provide the same low-loss edge coupling as the polished end-facets. This process can be applied to optical circuits containing planar ion-exchanged waveguides and 3D ultrafast laser-inscribed waveguides in the bulk glass without the need for post-polishing the end-facet and thus opens the opportunity for more rapid device prototyping and lower-cost high-volume manufacturing.
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Jason R. Grenier, Lars Brusberg, Chad C. Terwilliger, Kristopher A. Wieland, "Ultrafast laser singulation of optical circuits with optical quality end-facets," Proc. SPIE 11991, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XXII, 1199109 (4 March 2022); https://doi.org/10.1117/12.2613420