PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
A direct optical interface on ICs has the potential to ease the bandwidth bottlenecks in transferring data between advanced ICs. We demonstrate high speed microLEDs transferred onto silicon CMOS circuitry together with the integrated drivers for the LEDs to send data from the IC. On the receive side of the same IC, we demonstrate integrated CMOS detectors with trans-impedance and limiting amplifiers. These chips are shown to operate at Gb/s speeds and can be interfaced with multicore fibers to make simple low-cost data-paths between standard silicon ASICs. Compared to SERDES based interfaces where only a few lanes are run at very high speeds, these wide parallel optical interfaces can be considerably lower power and offer much higher overall bandwidth and bandwidth density. We demonstrate these links using 130nm CMOS process on SOI substrates, with <2pJ per bit and show their superior performance compared to FP lasers in terms of BER and mode partition noise.
Bardia Pezeshki,Farzad Khoeini,Alex Tselikov,Robert F. Kalman,Cameron Danesh, andEmad Afifi
"LED-array based optical interconnects for chip-to-chip communications with integrated CMOS drivers, detectors, and circuitry", Proc. SPIE 12007, Optical Interconnects XXII, 1200707 (5 March 2022); https://doi.org/10.1117/12.2614547
ACCESS THE FULL ARTICLE
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Bardia Pezeshki, Farzad Khoeini, Alex Tselikov, Robert F. Kalman, Cameron Danesh, Emad Afifi, "LED-array based optical interconnects for chip-to-chip communications with integrated CMOS drivers, detectors, and circuitry," Proc. SPIE 12007, Optical Interconnects XXII, 1200707 (5 March 2022); https://doi.org/10.1117/12.2614547