Presentation + Paper
5 March 2022 High-density passive multi-fiber assembly to single-mode polymer waveguides using embedded v-grooves for co-packaged optics
Author Affiliations +
Proceedings Volume 12007, Optical Interconnects XXII; 120070S (2022) https://doi.org/10.1117/12.2606344
Event: SPIE OPTO, 2022, San Francisco, California, United States
Abstract
We propose a novel high-density and low-profile multi-fiber passive assembly technology to polymer waveguides. We developed a small-sized ferrule with a footprint of only 5 × 5 mm and a thickness of 0.5 mm. An embedded 12 v-groove silicon chip was employed as a receptacle, and we formed the facet of waveguides on the v-groove chip. The optical properties for the proposed structure were experimentally demonstrated. The propagation loss of the single mode waveguides was as small as 0.5 dB/cm for the wavelength of 1310 nm and the average connecting loss of 3.06 dB was obtained.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tsuyoshi Aoki, Akihiro Noriki, Akio Ukita, Koichi Takemura, Isao Tamai, Yasuhiro Ibusuki, Taro Itatani, Satoshi Suda, Takayuki Kurosu, Fumi Nakamura, Daisuke Mizutani, and Takeru Amano "High-density passive multi-fiber assembly to single-mode polymer waveguides using embedded v-grooves for co-packaged optics", Proc. SPIE 12007, Optical Interconnects XXII, 120070S (5 March 2022); https://doi.org/10.1117/12.2606344
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Single mode fibers

Waveguides

Polymers

Optical testing

Prototyping

Silicon

Connectors

Back to Top