Next-generation thermal infrared hyperspectral imaging sensors

Benjamin Saute; Vince Morton; Jean-Philippe Gagnon; Philippe Lagueux; Martin Larivière-Bastien; Martin Chamberland

doi:10.1117/12.2619046

31 May 2022 Next-generation thermal infrared hyperspectral imaging sensors

Benjamin Saute, Vince Morton, Jean-Philippe Gagnon, Philippe Lagueux, Martin Larivière-Bastien, Martin Chamberland

Proceedings Volume 12094, Algorithms, Technologies, and Applications for Multispectral and Hyperspectral Imaging XXVIII; 1209408 (2022) https://doi.org/10.1117/12.2619046
Event: SPIE Defense + Commercial Sensing, 2022, Orlando, Florida, United States

Abstract

Telops has a 20-year history in the design, construction, and deployment of thermal infrared hyperspectral imaging systems through the legacy Hyper-Cam line. Advances in critical subsystem technologies has allowed Telops to develop the next-generation of hyperspectral imaging systems with significant reductions in size, weight, and power requirements while maintaining imaging and data quality performance. This reduction in SWaP requirements yields a significant increase in deployment flexibility, allowing for increased capability for collecting actionable hyperspectral data of remote or difficult-to-access targets. Also taking benefit of the most recent data processing capabilities from modern electronics and computer systems, the real-time data analysis has enabled unprecedented ease of use and conviviality without compromise to performance. This presentation will serve as an overview of the system architecture and analysis capabilities of three next-generation thermal infrared hyperspectral imaging products. These platforms include a tripod-based system for ground measurements; an airborne platform designed for small, fixed-wing aircraft; and a small-footprint system designed for deployment on a quadcopter or other small UAV.

Conference Presentation

Citation Download Citation

Benjamin Saute, Vince Morton, Jean-Philippe Gagnon, Philippe Lagueux, Martin Larivière-Bastien, and Martin Chamberland "Next-generation thermal infrared hyperspectral imaging sensors", Proc. SPIE 12094, Algorithms, Technologies, and Applications for Multispectral and Hyperspectral Imaging XXVIII, 1209408 (31 May 2022); https://doi.org/10.1117/12.2619046

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