Increase of wafer inspection tool throughput with computational imaging

Oleg Soloviev; Hieu Thao Nguyen; Jacques Noom; Michel Verhaegen

doi:10.1117/12.2618736

31 May 2022 Increase of wafer inspection tool throughput with computational imaging

Oleg Soloviev, Hieu Thao Nguyen, Jacques Noom, Michel Verhaegen

Proceedings Volume 12098, Dimensional Optical Metrology and Inspection for Practical Applications XI; 120980G (2022) https://doi.org/10.1117/12.2618736
Event: SPIE Defense + Commercial Sensing, 2022, Orlando, Florida, United States

Abstract

To increase the throughput of image-based wafer quality inspection tools, we propose to use computational imaging methods to address two main bottlenecks: the mechanical alignment of the wafer with the imaging plane and pixel size of the imager. The former requires significant time but is crucial for a reliable quality check, and the latter introduces a trade off between the wafer scanning speed and the minimum detectable defect size. We demonstrate application of our recently developed SANDR algorithm for obtaining a wafer image with sub-pixel resolution from a series of not-perfectly aligned low-resolution images. The wafer misalignment creates a varying over the field of view depth-of-focus, which poses a significant obstacle for the state-of-the-art methods, but is successfully processed with SANDR. The method is tested on simulated images.

Conference Presentation

Citation Download Citation

Oleg Soloviev, Hieu Thao Nguyen, Jacques Noom, and Michel Verhaegen "Increase of wafer inspection tool throughput with computational imaging", Proc. SPIE 12098, Dimensional Optical Metrology and Inspection for Practical Applications XI, 120980G (31 May 2022); https://doi.org/10.1117/12.2618736

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