An optimal design of soldering transition section between SMT RF connector and PCB

Guichen Wang; DingYi Wu; Dong Wang

doi:10.1117/12.2626917

14 February 2022 An optimal design of soldering transition section between SMT RF connector and PCB

Guichen Wang, DingYi Wu, Dong Wang

Proceedings Volume 12161, 4th International Conference on Informatics Engineering & Information Science (ICIEIS2021); 121611C (2022) https://doi.org/10.1117/12.2626917
Event: 4th International Conference on Informatics Engineering and Information Science, 2021, Tianjin, China

Abstract

With the continuous increase of signal transmission rate, the impact of soldering transition section between surface mount technology (SMT) radio frequency (RF) connector and printed circuit board (PCB) on the entire transmission path becomes more and more serious. In this paper, the transmission characteristics of soldering transition section are analyzed by means of scattering matrix, time domain reflectometry (TDR) and other tools in signal integrity analysis, and an equivalent circuit model based on stub lines is established. At the same time, the methods to improve impedance continuity and adjust cutoff frequency are proposed, such as reducing the radius of the pad, cutting out a circle on layer below the pad, biasing the center of circle cutout, increasing the impedance of the pad and the connecting segment of the transmission line, so as to optimize the transmission characteristics of 40-50GHz window. Full-wave simulation results show that these optimization methods can effectively reduce the reflection coefficient and improve the transmission coefficient in the optimization window. The experimental results show that the optimized scheme controls the S11 below -10dB from DC to 50GHz, which is much better than that of -5dB before optimization, and proves the effectiveness of the optimization.

Citation Download Citation

Guichen Wang, DingYi Wu, and Dong Wang "An optimal design of soldering transition section between SMT RF connector and PCB", Proc. SPIE 12161, 4th International Conference on Informatics Engineering & Information Science (ICIEIS2021), 121611C (14 February 2022); https://doi.org/10.1117/12.2626917

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KEYWORDS

Connectors

Dielectrics

Computer simulations

Device simulation

Manufacturing

Scattering

Reflection

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