Advances in low GWP etch gasses

Colin Jennings; Phong Nguyen; Scott Biltek; Nathan Stafford

doi:10.1117/12.2660136

1 May 2023 Advances in low GWP etch gasses

Colin Jennings, Phong Nguyen, Scott Biltek, Nathan Stafford

Proceedings Volume 12499, Advanced Etch Technology and Process Integration for Nanopatterning XII; 124990G (2023) https://doi.org/10.1117/12.2660136
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

Fluorinated species are ubiquitous in semiconductor manufacturing, yet are known to have global warming potentials thousands of times higher than CO₂. As abatement technologies are not completely effective and add additional costs, interest in reducing these emissions increases with semiconductor manufacturing volumes. We explore alternative chemistries for common plasma etch applications that retain patterning performance but with near zero GWP. Spectroscopic identification and quantification of etch byproducts is presented to demonstrate the beneficial environmental impacts of transitioning from the most common etch gasses.

Conference Presentation

Citation Download Citation

Colin Jennings, Phong Nguyen, Scott Biltek, and Nathan Stafford "Advances in low GWP etch gasses", Proc. SPIE 12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, 124990G (1 May 2023); https://doi.org/10.1117/12.2660136

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