Design of an on-chip optical beamforming network based on dense wavelength division multiplexing

Hanling Long; Wenhao Wu; Zhiqiang Qi; Chensheng Wang

doi:10.1117/12.2656439

9 January 2023 Design of an on-chip optical beamforming network based on dense wavelength division multiplexing

Hanling Long, Wenhao Wu, Zhiqiang Qi, Chensheng Wang

Proceedings Volume 12507, Advanced Optical Manufacturing Technologies and Applications 2022; and 2nd International Forum of Young Scientists on Advanced Optical Manufacturing (AOMTA and YSAOM 2022); 125072C (2023) https://doi.org/10.1117/12.2656439
Event: 2nd International Forum of Young Scientists on Advanced Optical Manufacturing (AOMTA and YSAOM 2022), 2022, Changchun, China

Abstract

The optical beamforming network (OBFN) is a promising alternative of traditional electronic phase shifter due to the advantage of eliminating the so-called beam squint behavior. Herein, a series of optical true time delay lines (OTTDLs) based on silicon on insulator (SOI) platform are proposed to produce OBFNs with multi-beam steering characteristics. A series of OBFN chips is designed to realize 34 specific delay steps between -21~+21 ps in order to achieve a nominal equal difference beam steering angle between ±45°. To pursue good beam quality, 32 delay waveguide channels are proposed according to the number of array elements. The optical carriers in each channel are densely multiplexed off-chip with a frequency difference of 100 GHz in C-band, and coupled on-chip by a grating coupler. Variable optical attenuators (VOAs) based on Mach-Zehnder interferometer (MZI) structure are introduced to tune the optical outputs of the 32 channels with a discrepancy less than ±1 dB. The OTTDLs are compatible with CMOS process, and appeared in a compact footprint of only 0.163 mm² for a maximum true time delay of 651 ps. Such a compact waveguide layout leads to the footprint of a single chip within 2.5 mm×7.5 mm. Meanwhile, the operating temperature is under closed-loop control via a pair of thermoelectric cooler (TEC) and negative temperature coefficient thermistor (NTC). Together with hermetic package, the reliability of the OBFN chips can also be promoted.

Citation Download Citation

Hanling Long, Wenhao Wu, Zhiqiang Qi, and Chensheng Wang "Design of an on-chip optical beamforming network based on dense wavelength division multiplexing", Proc. SPIE 12507, Advanced Optical Manufacturing Technologies and Applications 2022; and 2nd International Forum of Young Scientists on Advanced Optical Manufacturing (AOMTA and YSAOM 2022), 125072C (9 January 2023); https://doi.org/10.1117/12.2656439

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