Highly sensitive x-ray and electron-beam resists using chemical amplification

Ralph R. Dammel; Charlet R. Lindley; Georg Pawlowski; Ude Scheunemann; Juergen Theis

doi:10.1117/12.20134

1 June 1990 Highly sensitive x-ray and electron-beam resists using chemical amplification

Ralph R. Dammel, Charlet R. Lindley, Georg Pawlowski, Ude Scheunemann, Juergen Theis

Proceedings Volume 1262, Advances in Resist Technology and Processing VII; (1990) https://doi.org/10.1117/12.20134
Event: Microlithography '90, 1990, San Jose, CA, United States

Abstract

Highly sensitive resist materials are one of the prerequisites for the economic viability of X- ray and E -beam lithography. The principle of chemical anzphfication coupled with the three - component system (3CS) concept leads the way to the design of highly sensitive, yet as the same time process stable materials which fulfill the requirements of modem semiconductor patterning methods. Two experimental 3CS resist systems using chemical amplification, the positive -tone resist RAY- PF and and the negative - tone resist RAZ PNJJ4, will be presented, and their suitability for X- ray and E - beam application exa,nined.

Citation Download Citation

Ralph R. Dammel, Charlet R. Lindley, Georg Pawlowski, Ude Scheunemann, and Juergen Theis "Highly sensitive x-ray and electron-beam resists using chemical amplification", Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990); https://doi.org/10.1117/12.20134

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