Industrial solution for 12-in. wafer high speed quality inspection: FSS 310

M. Kogel-Hollacher; S. Weiss; S. Mieth; O. Schulz

doi:10.1117/12.2675224

4 October 2023 Industrial solution for 12-in. wafer high speed quality inspection: FSS 310

M. Kogel-Hollacher, S. Weiss, S. Mieth, O. Schulz

Proceedings Volume 12684, ODS 2023: Industrial Optical Devices and Systems; 1268408 (2023) https://doi.org/10.1117/12.2675224
Event: SPIE Optical Engineering + Applications, 2023, San Diego, California, United States

Abstract

The increasing demands in industry, for example for products in the consumer electronics sector or for assistance systems in cars, and the continuous development in semiconductor are leading to significant miniaturization in electronic components. These requirements are inevitably also transferred to ultra-precise manufacturing and thus ask for monitored production steps. In the context of Industry 4.0 and other developments in the context of modern production sensors to supervise production steps are crucial. An essential component here is non-destructive testing (NDT) and specifically optical metrology and overall end of line qualification. The FlyingSpotScanner (FSS) provides OCT measurements for thickness and topography based on a breakthrough, unique technology that enables high-speed, non-contact inspection for quality assurance across a wide range of materials and surfaces. The FSS310 Version has changed the semiconductor market. Thanks to its huge scan area of 310mm, a 12 inches diameter wafer can be fully checked for TTV, bow and warp in just 10 seconds. Due to the movable mirror system, long paths of linear axes are replaced by short rotary movements, resulting in an extreme reduction of the measuring time. The FLYING SPOT SENSOR FSS310 was awarded with the SPIE Prism Award in 2023.

Conference Presentation

(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

M. Kogel-Hollacher, S. Weiss, S. Mieth, and O. Schulz "Industrial solution for 12-in. wafer high speed quality inspection: FSS 310", Proc. SPIE 12684, ODS 2023: Industrial Optical Devices and Systems, 1268408 (4 October 2023); https://doi.org/10.1117/12.2675224

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