Poster + Paper
12 March 2024 Volumetric photoacoustic imaging using low-cost and easily fabricated planar array ultrasound transducers
Author Affiliations +
Conference Poster
Abstract
2-D Ultrasound (US) Transducer (2D-UST) arrays facilitate scan-less volumetric photoacoustic imaging (3D-PAI), but are typically high-cost, involve laborious fabrication process, and permit limited scalability in design with respect to array parameters like element count, aperture size, center frequency ( 𝑓c) and array pitch. In this work, we report a novel, 2-D matrix UST array fabricated on a printed circuit board (PCB) substrate (2D-PCB-UST array) at low-cost and without the need of advanced cleanroom fabrication technologies. Further, the 2D-PCB-UST array parameters can be easily modified with PCB design software. We demonstrate the scalability by fabricating two arrays, (i) an 8×8 array with 1.5 mm pitch and 𝑓c 40 MHz, and (ii) an 4×4 array with 1.2 mm pitch and 𝑓c 11 MHz. Initial characterization results demonstrate wideband PA receive sensitivity, characterized by the 6-dB fractional bandwidth for both low and high frequency UST arrays. Phantom imaging results demonstrate 3D-PAI capabilities despite low element count and sparse array geometry.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Mahaan Mitra, Akshay Kumar, Shubham Khandare, Prameth Gaddale, Yashoda Anandan, Srian Pedibhotla, Kaustav Roy, Haoyang Chen, Rudra Pratap, and Sri-Rajasekhar Kothapalli "Volumetric photoacoustic imaging using low-cost and easily fabricated planar array ultrasound transducers", Proc. SPIE 12842, Photons Plus Ultrasound: Imaging and Sensing 2024, 128420R (12 March 2024); https://doi.org/10.1117/12.3001634
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Imaging arrays

Fabrication

3D acquisition

3D image processing

Data acquisition

Photoacoustic imaging

Ultrasound transducers

Back to Top