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27 October 2023 Structural optimization of DC molded case circuit breakers based on temperature field analysis
Jing Zhao, Dianzuo Cheng, Yimin You
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Proceedings Volume 12922, Third International Conference on Electronics, Electrical and Information Engineering (ICEEIE 2023); 129221P (2023) https://doi.org/10.1117/12.3008865
Event: The Third International Conference on Electronics, Electrical and Information Engineering (ICEEIE 2023), 2023, Xiamen, China
Abstract
To ensure the operation stability of DC Molded Case Circuit Breakers (MCCB), by analyzing the structure of DC MCCB and taking the internal electric field of DC MCCB as the research object, a finite element software Ansys Workbench is used to build and analyze the temperature field simulation model of DC MCCB. According to its internal the distribution of internal temperature and air flow, it is concluded that some plastic parts can hinder the internal air flow and affect the heat dissipation of circuit breaker. The simulation results show that the temperature rise of plastic parts and the maximum temperature of contacts can be effectively reduced by shortening the connecting plate of the upper cover and punching the bracket of the moving contact, so that the internal temperature will not be too high, which enhances the operation reliability of DC MCCB.
(2023) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Jing Zhao, Dianzuo Cheng, and Yimin You "Structural optimization of DC molded case circuit breakers based on temperature field analysis", Proc. SPIE 12922, Third International Conference on Electronics, Electrical and Information Engineering (ICEEIE 2023), 129221P (27 October 2023); https://doi.org/10.1117/12.3008865
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KEYWORDS
Temperature distribution
Resistance
Temperature metrology
Analytical research
Circuit switching
Bridges
Device simulation
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