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10 April 2024 Improving line edge roughness using virtual fabrication
Qingpeng Wang, Yu Jia Zhong, Timothy Yang, Lifei Sun, Pengfei Lyu, Benjamin Vincent, Ivan Chakarov, Joseph Ervin
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Proceedings Volume 12954, DTCO and Computational Patterning III; 129541D (2024) https://doi.org/10.1117/12.3010206
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States
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Abstract
In this paper, we systematically explore potential Line edge roughness (LER) improvements that may be achieved on both line and via patterns by using the deposition/etch cycling process by virtual fabrication. The results show that deposition/etch cycling process is very effective in reducing high frequency noise and most of the LER and CD uniformity improvement occurs during the first deposition/etch cycle. These results can provide quantitative guidance on the optimal selection of deposition/etch amounts and the number of cycles needed to reduce LER.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
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Qingpeng Wang, Yu Jia Zhong, Timothy Yang, Lifei Sun, Pengfei Lyu, Benjamin Vincent, Ivan Chakarov, and Joseph Ervin "Improving line edge roughness using virtual fabrication", Proc. SPIE 12954, DTCO and Computational Patterning III, 129541D (10 April 2024); https://doi.org/10.1117/12.3010206
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KEYWORDS
Line edge roughness
Etching
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