Presentation
10 April 2024 Grazing-incidence reflective x-ray holography for CD metrology with nanometer resolution
Miaoqi Chu, Jin Wang, Zhang Jiang
Author Affiliations +
Abstract
The paradigm shift to extreme ultraviolet (EUV) lithography for circuits with sub-10 nm nodes brought about ultrahigh-precision optics and masks in reflective optical paths, creating challenges in the fabrication and metrology of the elements. The reflective optics and masks and ultrafine reticles on wafers offer the impetus of new complimentary CD metrology techniques that offer high-resolution dimensional probes in reflection geometry. In this work, we developed reflective hard X-ray holography imaging as the next-generation metrology tool for EUVL wafers/optics and wafers, without any sample modifications (milling and thinning). We demonstrate the capability of a new surface-reflection-based X-ray holography method for determining 3D dimensions of planar surface patterns supported by simple (but thick) substrates with nanometer resolutions. We anticipate that the holographic imaging technique will immediately benefit the nondestructive CD metrology of EUV reflective optics, masks, and reticles on wafers.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Miaoqi Chu, Jin Wang, and Zhang Jiang "Grazing-incidence reflective x-ray holography for CD metrology with nanometer resolution", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 1295510 (10 April 2024); https://doi.org/10.1117/12.3011020
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KEYWORDS
Critical dimension metrology

Holography

EUV optics

Optics manufacturing

Photomasks

Wafer-level optics

Extreme ultraviolet

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