Motivating automated multimodal failure analysis for heterogeneously integrated devices

Patrick Craig; Nitin Varshney; Antika Roy; Charles Woychik; Hamed Dalir; Navid Asadizanjani

doi:10.1117/12.3028177

24 October 2024 Motivating automated multimodal failure analysis for heterogeneously integrated devices

Patrick Craig, Nitin Varshney, Antika Roy, Charles Woychik, Hamed Dalir, Navid Asadizanjani

Author Affiliations +

Proceedings Volume 13152, Developments in X-Ray Tomography XV; 1315228 (2024) https://doi.org/10.1117/12.3028177
Event: Optical Engineering + Applications, 2024, San Diego, California, United States

Conference Poster

Abstract

The semiconductor industry’s advancements in advanced packaging and heterogeneous integration have outpaced traditional failure analysis and quality assurance capabilities. Existing non-destructive characterization methods face challenges regarding the small-scale interconnections and multi-layer stack structure of HI packaging. This paper explores the challenges in assuring the reliability of these heterogeneously integrated ICs and proposes a multi-modal approach combining Scanning Acoustic Microscopy and X-ray imaging for comprehensive analysis. SAM offers high-resolution acoustic imaging but faces difficulties in characterizing small-scale interconnects. Similarly, x-ray imaging provides advantageous resolution, but struggles with large sample sizes and long acquisition times. By combining these modalities, this research aims to bolster failure analysis and quality assurance for these up-and-coming technologies.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Patrick Craig, Nitin Varshney, Antika Roy, Charles Woychik, Hamed Dalir, and Navid Asadizanjani "Motivating automated multimodal failure analysis for heterogeneously integrated devices", Proc. SPIE 13152, Developments in X-Ray Tomography XV, 1315228 (24 October 2024); https://doi.org/10.1117/12.3028177

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