Paper
25 February 1993 Modeling of convective subcooled boiling in microtubes for high heat fluxes
Myron A. Hoffman, James D. Stetson IV
Author Affiliations +
Abstract
Cooling systems for very compact electronic components and computer chips are being miniaturized to meet the need for smaller overall packaging. One of the important present directions has been to use laminar flow in very small channels with hydraulic diameters in the sub-millimeter range to get high heat transfer coefficients with low pressure drops. It has been speculated that there might be some advantage to having convective subcooled boiling (SCB) occur in the micro-channels. As a first step in the evaluation of the utility of subcooled boiling in these micro-channels, a model has been developed for subcooled boiling in sub-millimeter diameter microtubes subject to uniform heat flux. This model builds on a previously well-validated computer code for convective subcooled boiling in tubes down to 1.57 mm inner diameter. The basic features of the new microtube model are described and some predictions using this model for 0.3 mm and 0.1 mm microtubes subject to a high heat flux of 10 MW/m2 are given.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Myron A. Hoffman and James D. Stetson IV "Modeling of convective subcooled boiling in microtubes for high heat fluxes", Proc. SPIE 1739, High Heat Flux Engineering, (25 February 1993); https://doi.org/10.1117/12.140537
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Cited by 1 scholarly publication.
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KEYWORDS
Heat flux

Data modeling

Thermal engineering

Cooling systems

Liquids

Scanning probe lithography

Electronic components

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