Paper
15 February 1994 Fabrication of sub-40-nm p-n junctions for 0.18-μm MOS device applications using a cluster-tool-compatible, nanosecond thermal doping technique
Kurt H. Weiner, Anthony M. McCarthy
Author Affiliations +
Abstract
In this paper, we introduce an alternative deep-submicrometer doping technology, Projection Gas Immersion Laser Doping (P-GILD). Representing the marriage of lithography and diffusion, P-GILD is a resistless, step-and-repeat doping process that utilizes excimer laser light patterned by a dielectric reticle to selectively heat and, thereby, dope regions of an integrated circuit. Results of physical and electrical characterization are presented for ultra-shallow p+-n and n+-p junctions produced by gas immersion laser doping (GILD), a phenomenologically identical technique that utilizes an aluminum contact mask rather than a dielectric reticle to pattern the beam. Junctions produced using GILD exhibit uniformly-doped, abrupt impurity profiles with no apparent defect formation in the silicon.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kurt H. Weiner and Anthony M. McCarthy "Fabrication of sub-40-nm p-n junctions for 0.18-μm MOS device applications using a cluster-tool-compatible, nanosecond thermal doping technique", Proc. SPIE 2091, Microelectronic Processes, Sensors, and Controls, (15 February 1994); https://doi.org/10.1117/12.167367
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Cited by 1 scholarly publication and 15 patents.
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KEYWORDS
Doping

Resistance

Diodes

Silicon

Diffusion

Gas lasers

Semiconducting wafers

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