Paper
7 March 1994 High-throughput miniaturized 3D computer for remote applications
Stanley Lis, Michael J. Little
Author Affiliations +
Proceedings Volume 2102, Coupling Technology to National Need; (1994) https://doi.org/10.1117/12.170643
Event: Coupling Technology to National Need, 1993, Albuquerque, NM, United States
Abstract
Remote sensing requires very high processing throughputs. The details of the processing vary tremendously from one scenario to another. Through simulations we have shown that the 3-D computer efficiently executes a wide range of processing from a broad spectrum of sensors. In this paper we describe the architecture, the new 3-D technologies, and then discuss the application of this technology to public safety monitoring applications.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stanley Lis and Michael J. Little "High-throughput miniaturized 3D computer for remote applications", Proc. SPIE 2102, Coupling Technology to National Need, (7 March 1994); https://doi.org/10.1117/12.170643
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KEYWORDS
Semiconducting wafers

Silicon

Array processing

Signal processing

Switching

3D image processing

Aluminum

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