National lithography roadmap: wafer requirements in the year 2000

Karen H. Brown

doi:10.1117/12.195838

7 December 1994 National lithography roadmap: wafer requirements in the year 2000

Karen H. Brown

Proceedings Volume 2322, 14th Annual BACUS Symposium on Photomask Technology and Management; (1994) https://doi.org/10.1117/12.195838
Event: 14th Annual BACUS Symposium on Photomask Technology and Management, 1994, Santa Clara, CA, United States

Abstract

This paper sets a framework for those which follow. The National Lithography Roadmap has been enhanced in 1994 to include a systems approach to lithographic requirements. The lithography specifications at the wafer level which will be required in the manufacture of gigabit chips are described with an emphasis on critical dimension tolerances and overlay. These critical needs place stringent requirements on the total system. The National Roadmap is discussed with an emphasis on the interaction between wafer level measurements and the lithographic system requirements necessary to achieve them.

Citation Download Citation

Karen H. Brown "National lithography roadmap: wafer requirements in the year 2000", Proc. SPIE 2322, 14th Annual BACUS Symposium on Photomask Technology and Management, (7 December 1994); https://doi.org/10.1117/12.195838

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