Batch-dissolved wafer process for low-cost sensor applications

Steve T. Cho

doi:10.1117/12.221265

19 September 1995 Batch-dissolved wafer process for low-cost sensor applications

Steve T. Cho

Proceedings Volume 2639, Micromachining and Microfabrication Process Technology; (1995) https://doi.org/10.1117/12.221265
Event: Micromachining and Microfabrication, 1995, Austin, TX, United States

Abstract

As microsensor technology continues to grow and mature, the issues of cost and manufactureability become key issues in determining whether silicon transducer technologies are commercially viable. The dissolved wafer process is an attractive manufacturing technology for the production of low cost, high volume transducers. The process requires only 3 masking steps and the tooling for micromachining is inexpensive. Six sigma level yield is attainable and the turnaround time for a lot is 1.5-2 weeks for one work shift operation. This technology is currently being implemented in commercial production low cost inertial instruments.

Citation Download Citation

Steve T. Cho "Batch-dissolved wafer process for low-cost sensor applications", Proc. SPIE 2639, Micromachining and Microfabrication Process Technology, (19 September 1995); https://doi.org/10.1117/12.221265

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